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4 Layer 0.5oz Copper Thickness PCB Fabrication Fr4 High Tg 170 Immersion Gold

China 4 Layer 0.5oz Copper Thickness PCB Fabrication Fr4 High Tg 170 Immersion Gold, Find details about China 4layer, PCB Manufacturing from 4 Layer 0.5oz Copper Thickness PCB Fabrication Fr4 High Tg 170 Immersion Gold

Model NO.
A95
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Fast Turn
Board Thickness
1.57mm
Copper
1oz
Surface Finished
Enig
Board Material
Isola Is410
Delivery
5working Days
Layer
4
Impedance Control
No
Min Hole Wall
No
Panel
144.805mm*159.563mm(4UPS)
Standard
Ipc Class 2
Destination of Shipment
USA
Special Process
No
Trademark
Fast turn
Transport Package
Vacuum Packaging
Specification
144.805mm*159.563mm(4ups)
Origin
China
HS Code
8534001000

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