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SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved

China SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved, Find details about China Reflow Soldering Oven, PCB Assembly Machine from SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved

Model NO.
IN12
Heating Zone
Upper6/ Down6
Transmission
Mesh Chain Drive
Chain Speed
50-600mm/ Min
Temperature Range
Room Temperature- 300 Degree
Temperature Accuracy
1 Degree
PCB Temperature Deviation
+/-2 Degree
Max. PCB Width
350mm
Max. Sodering Height
35mm (Including PCB Thickness)
Heat-up Time
30 Min
Trademark
NeoDen
Transport Package
Fumigation Free Wooden Case
Specification
2300*650*1280mm
Origin
Zhejiang, Cn
HS Code
84798962
Model NO.
IN12
Heating Zone
Upper6/ Down6
Transmission
Mesh Chain Drive
Chain Speed
50-600mm/ Min
Temperature Range
Room Temperature- 300 Degree
Temperature Accuracy
1 Degree
PCB Temperature Deviation
+/-2 Degree
Max. PCB Width
350mm
Max. Sodering Height
35mm (Including PCB Thickness)
Heat-up Time
30 Min
Trademark
NeoDen
Transport Package
Fumigation Free Wooden Case
Specification
2300*650*1280mm
Origin
Zhejiang, Cn
HS Code
84798962

CE approved SMT reflow oven NeoDen IN12

Applicable to: Prototype, LED long board soldering, 0201/ IC soldering (Pb/ Pb-free) in SMT assembly process.
Uppper 6/ Down6 heating zones

Features

1. Built-in welding smoke filtering system, effective filtration of harmful gases, elegant appearance and eco-friendly, more in line with the high-end use environment.

2. The control system has features of high integration, timely response, low failure rate and convenient maintenance.

3. The unique design of heating module has the characteristics of high temperature control accuracy, uniform temperature distribution in the thermal compensation area, high thermal compensation efficiency and low power consumption.

4. Hot air convection, excellent soldering performance.

5. High-performance aluminum alloy heating plate instead of heating pipe, both energy-saving and high-efficient, and transverse temperature deviation is significantly reduced compare to the similar reflow oven products in the market.

6. Heat insulation protection design, the casing temperature can be effectively controlled.

7. Smart control with high sensitivity temperature sensor, the temperature can be effectively stabilized.

8. Intelligent, the custom developed intelligent control system, easy to use and powerful.

9. Professional and unique 4-way board surface temperature monitoring system, can give timely and comprehensive data feedback in actual operation, which can effectively cope with any complex electronic products.

10. 40 working files can be stored for an easy loading during the working process.

11. PCB soldering temperature curve can be displayed based on real-time measurement.

12. Lightweight, miniaturization, professional industrial design, flexible application site, more user-friendly.

13. Energy saving, low power consumption, low power supply requirements, the ordinary civil electricity can meet the use. Compared with similar products in the market, the electricity costs that this machine can save for you within one year, enables you to purchase your second IN12.

14. The custom-developed stainless steel B mesh belt is durable and wear-resistant. Not easy to deform after long time using.

15. Beautiful and elegant indicator design with red, yellow and green alarm function.

16. Custom-developed drive motor based on the characteristics of the B mesh belt to ensure uniform speed and long life.

17 .The mesh sprocket made of high-precision profile technology and the unique support structure can effectively reduce the vibration of the PCB in the reflow zones, and easily cope with the welding of small size components such as 0201 and complex chips such as BGA/QFP/QFN.

18. The cooling zone with independent circulating air design completely isolates the influence of the external environment on the internal temperature chambers.

19. The optimized welding fume filter systems tested by the dedicated airflow simulation software can filter harmful gases as well as ensuring IN12 can keep room temperature, reducing heat loss and reducing working power consumption.

20. The unique heating plate design effectively ensures IN12 will cool down evenly once the heating is stopped, and effectively prevents the deformation and damage caused by the rapid temperature drop

21. The internal thermostat is made of stainless steel, which is environment friendly and has no peculiar smell. The inner sides are equipped with insulation cotton to effectively prevent heat loss.

22. Hidden screen design is convenient for transportation, easy to use.

23. The control system adopts imported chips, and the temperature control accuracy reaches ±0.5%.

24. Adjustable wind speed in all heating zones and cooling zones, easily coping with various welding requests.

25. The upper temperature cover is automatically limited once opened, effectively ensuring the personal safety for the operators.

26. Exclusively designed PCB guide device to realize the direct connection between the mesh chain and the conveyor.

SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved
Parameter
 
ModelNeoDen IN12
Heating Zone QuantityUpper6 / Down6                                              
Cooling FanUpper4 
ControllerVGUS Microcomputer
TransmissionMesh Chain Drive
Heating TypeNichrome Wire & Aluminum Alloy Heating
Conveyor Speed50~600 mm/min
Temperature RangeRoom temperature~300ºC
Temperature Accuracy1ºC
PCB Temperature Deviation±2ºC
Max Soldering Width (PCB Width)350mm
Length Process Chamber1354mm
Heat-up Time30 min
 Max Soldering Height (mm)35mm (includes PCB thickness)
Operation Directionleft→right
Electricity SupplyAC 220v/single phase
Starting Power 2.4kw~4.8kw (adjustable)
Typical Working Powerapprox. 2kw(1.5mm fiberglass PCB )
Machine SizeL2300mm×W650mm×H1280mm
Packing SizeL2420mm×W730mm×H1430mm
Net Weight300KGS
Gross Weight383KGS

SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved
SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE ApprovedSMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved

What is reflow soldering

The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board.
The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.

What is a brief SMT process

Preparation board/ solder paste→ Screen printing→ Component placement→ Component inspection→ Reflow soldering→ Cleaning→ Solder joint inspection→ Cicuit testing→ Packaging → Finish.

Welcome to visit NeoDen

SMT PCB Soldering Reflow Oven (NeoDen IN12) with 12 Heating Zone and CE Approved
 

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