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0.3mm FPC Printed Circuit Board Single Layer

China 0.3mm FPC Printed Circuit Board Single Layer, Find details about China PCB Board, PCB Assembly from 0.3mm FPC Printed Circuit Board Single Layer

Model NO.
lvmay-023
Processing Technology
Electrolytic Foil
Base Material
FPC
Insulation Materials
Organic Resin
Transport Package
Cartons
Origin
China
Model NO.
lvmay-023
Processing Technology
Electrolytic Foil
Base Material
FPC
Insulation Materials
Organic Resin
Transport Package
Cartons
Origin
China
Shenzhen LvMeiJinYu Electronic Co.,Ltd
 
     Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc.. 

     Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends.

     Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.

 0.3mm FPC Printed Circuit Board Single Layer    0.3mm FPC Printed Circuit Board Single Layer   0.3mm FPC Printed Circuit Board Single Layer


1.  Process capacity
NOItemCapabilities
1Number of Layers 2-20 layers 
2Finished Board Size(Max)21.5″×24.5″(546mm×622mm)
3Finished Board Thicknes0.126″- 0.016″ (0.3mm-3.2mm)
4Finished Board Thickness 
Tolerance		±10%
±3mil (board thickness≤ 0.8mm)
Board Thickness ≤ 0.8mm
5Warp age(Min)≤0.7%
6Drill Hole Diameter0.005"-0.255" (0.15mm~6.5mm)
7Base Copper Thickness of Outer 
Layer		1/3 OZ-3OZ (0.012mm -0.102mm)
8Base Copper Thickness of Inner 
Layer		1/2 OZ-3 OZ (0.017mm -0.105mm)
9Type of Base MaterialFR-4 (130ºCTg-180ºCTg),CEM3,etc
10Aspect Ratio of Plated Hole(Max)10:01:00
11Hole Diameter Tolerance(PTH)±3mil ( ±0.075mm)
12Hole Diameter Tolerance(NPTH)±1mil ( ±0.025mm)
13Copper Thickness of PTH Wall≥0.8mil (≥0.020mm)
14Design Line Width/Space
of Inner Layer(Min)		H/HOZ 3.0mil/3.0mil(0.075mm /0.075mm)
1/1OZ 4mil/4mil(0.1016mm/ 0.1016mm)
2/2OZ 5mil/5mil(0.127mm/0.127mm)
15Design Line Width/Space
of Outer Layer(Min		T/TOZ 3.0mil/3.0mil (0.075mm/ 0.075mm)
H/HOZ 3.5mil/3.5mil(0.089mm/0.089mm)
1/1OZ 4.5mil/4.5mil (0.114mm/0.114mm )
2/2OZ 6mil/6mil (0.152mm/0.152mm )
3/3OZ 7mil/7mil (0.152mm/0.152mm)
16Solder Mask Bridge(Min) 2. 5mil (0.064mm)
17Dimension Tolerance (Hole to 
Edge)(Min)		±4mil ( ±0.101mm)
18Thermal Shock 288 ºC 10secs(3times)
19Ionic Contamination <1.56ug/cm2(NaCl)
20Peel Strength ≥1.4N/mm
21Natural Impedance Control±10%
22Solder Mask Strength>6H
23Surface TreatmetNickel /Gold Plating, HASL(Lead-free), OSP, 
ENIG, Immersion Silver, Carbon Oil, 
Peelable Mask, etc.

2. Lead Time
0.3mm FPC Printed Circuit Board Single Layer

3. Major Equipment
0.3mm FPC Printed Circuit Board Single Layer
4. Main Customers
0.3mm FPC Printed Circuit Board Single Layer


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