Room Temperature Curing Environmentally Friendly Epoxy Resin Is Used for Potting and Maintenance of Electronic Components
China Room Temperature Curing Environmentally Friendly Epoxy Resin Is Used for Potting and Maintenance of Electronic Components, Find details about China Adhesive, Waterproof from Room Temperature Curing Environmentally Friendly Epoxy Resin Is Used for Potting and Maintenance of Electronic Components
Basic Info.
Certification
ISO14001, CCC, RoHS, ISO9001
Formation Mechanism
Conversion Type
Application
Electronic Packaging
Another Name
Epoxy Adhesive
Advantage
Good Fluidity, High Hardness, No Bubbles
Package
Bottle
MOQ
15kg
Viscosity
5000cps
Type
Two Component
Classification
Double Components Adhesives
Usage
Electronic Transformers, Circuit Boards, High-Volt
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Certificate
SGS
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Certification
ISO14001, CCC, RoHS, ISO9001
Formation Mechanism
Conversion Type
Application
Electronic Packaging
Another Name
Epoxy Adhesive
Advantage
Good Fluidity, High Hardness, No Bubbles
Package
Bottle
MOQ
15kg
Viscosity
5000cps
Type
Two Component
Classification
Double Components Adhesives
Usage
Electronic Transformers, Circuit Boards, High-Volt
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Certificate
SGS
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Product Desciption
Packaging & Delivery
Port
Guangzhou
Lead Time:
Guangzhou
Lead Time:
| Quantity(Kilograms) | 1 - 10000 | >10000 |
| Est. Time(days) | 15 | To be negotiated |
Performance before curing
| Project | Unit | Parameter value | Detection method | |
| Exterior | A component | --------- | Black liquid | Visually |
| B component | --------- | Brown liquid | Visually | |
| Viscosity | A component | 25ºC Pa.s | 8500-9500 | -------------- |
| B component | 25ºC Pa.s | 250-350 | -------------- | |
| Proportion | A component | 25ºC g/cm3 | 1.50 | -------------- |
| B component | 25ºC g/cm3 | 1.50 | -------------- | |
| The mixing ratio | Proportion(A:B) | 100:20 | -------------- | |
Performance after curing
| Project | Unit | Parameter value | Detection method |
| Hardness | SHORE D | 80±3 | --------------- |
| Volume resistance | 25ºC Ohm-cm | 1.35*1015 | --------------- |
| Surface resistance | 25ºC Ohm | 1.2*1014 | --------------- |
| Withstand voltage | 25ºC KV/MM | 16-18 | --------------- |
| Dielectric constant | 1KHZ | 3.8-4.2 | --------------- |
| About potting |
When using, please check the A and B agents to observe whether there is sedimentation, and fully stir the A and B agents evenly, take the amount according to the proportion, and the weighing is accurate, please remember that the proportion is the weight ratio rather than the volume ratio. After mixing the A and B agents, stir thoroughly to avoid incomplete curing.
| APPLICATION |
| Packing |
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