China High Thermal Conductivity Aln Aluminium Nitride Ceramic Substrate, Find details about China Aln Ceramic Sheet, Laser Aluminum Nitride Ceramic Plate from High Thermal Conductivity Aln Aluminium Nitride Ceramic Substrate
Product Name | Metallized Aluminum Nitride Substrate for Laser Diode Array Manufacturing |
Material | AlN |
Color | Gray |
Size | As per drawing |
Processing | Polishing,Laser cutting,Slloting etc. |
Payment | T/T,Western Union,Online payment by credit card are available |
Application | It is widely used as Heat radiation substrate/Chamber parts for semiconductor process equipment. |
Thransport | Air transport: 5-10 days; Ocean shipping: About one month. |
Delivery Time | 1.Stock:delivery within 3-5 days after receiving your payment. 2. OEM/ODM:The normal Lead time is 15-45 days, which depends on your quantiy. |
MATERIAL PROPERTIES
Material Properties of Aluminum Nitride Substrate/Wafer | |
Property Content | Property Index |
Density(g/cm3) | 3.335 |
Resistance to Thermal Shock | No Cracks |
Thermal conductivity(30°C, W/m.k) | ≥170 |
Linear expansion coefficient (/°C, 5°C/min, 20-300°C) | 2.805×10-6 |
Flexural strength (MPa) | 382.7 |
Volume Resistivity (Ω.cm) | 1.4×1014 |
Dielectric constant(1MHz) | 8.56 |
Chemical Durability (mg/cm2) | 0.97 |
Dielectric strength (KV/mm) | 18.45 |
Surface roughness Ra(μm) | 0.3~0.5 |
Camber (length‰) | ≤2‰ |
Appearance/ Color | Dense/ Dark Gray |
Note: The general characteristics of the materials described above were derived from laboratory test performed by Innovacera from time on sample quantities. Actual characteristics of production lots may vary. |
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