Feature

1. High hardness , diversity                

2. High precision and density

3. High reliability and stability            

4. High thermal conductivity

5. Wide scope of application

6. Extremely abrasive resistance performance  

Product Introduction

Aluminum nitride ceramic substrate, high thermal conductivity, low coefficient of expansion,

high strength, high temperature resistance, chemical resistance, high resistivity , low dielectric

loss, is the ideal LSI heat dissipation board and packaging materials.  

Application

high-power circuits

Al evaporation pan

GaAs crystal crucible

RF and microwave circuits

MHD power generation equipment

Non-standard products , please contact us to provide drawings of your products. welcome drawings processing customized zirconia /alumina / aluminum nitride .