FCCL - PI Copper Clad Laminate

Description:

SPECIFICATION:

Base PI film: 0.5 ~ 2.0mils thickness;
Copper foil: EDHD & RA copper both available, 1/3, 1/2, 1.0 & 2.0 Oz thicknesses;
Adhesive: Modified epoxy adhesive, 0.5 ~ 0.7 mils;
Laminate structure: Single side & Double sides both available;

FEATURE:

• Meet the RoHS requirement & halogen free, and pass SGS certificate.
• Higher bond strength, good dielectric properties
• Excellent chemical and solvent resistance, good solder heating resistance.
• Excellent dimensional stability.

APPLICATION: Widely used in the data communication, aerospace,

personal computer and automotive fields.

Especially recommended to the following types of FPC(Flexible Printed Circuit) customers:

1. Customers who are troubled by current FCCL stack-up(PI and copper layer),so couldn't satisfy latest design trend of small, short and light-weighted for electronic products.
    
2. Customers who use the method of "selective copper plating" in the Pattern Process stage.
   
   In the Pattern Process stage, the copper layer is grown by the method of "selective copper plating", and then the excess copper is etched with chemical liquid, leaving the circuit they need.
   (The advantage of our FCCL: Thickness of copper layer is ranged from 2um to 8um, which shortens process time and risk of undercut during patterning.)