PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly

China PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly, Find details about China PCBA, PCB from PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly

Model NO.
CM-067
Condition
New
Trademark
OEM
Transport Package
Vacuum Package
Specification
15cm*12cm
Origin
China
HS Code
85340090
Model NO.
CM-067
Condition
New
Trademark
OEM
Transport Package
Vacuum Package
Specification
15cm*12cm
Origin
China
HS Code
85340090
Company Information

Canm Technology Co.,Ltd is a professional OEM manufacturer in Guangdong, China, which main product is PCB, PCBA and Camera module. We provide complete turnkey solution includes PCB design/layout ,PCB fabrication, component assembly, box assembly, parts procurement, component forming and electrical testing. From ideation to assembly to delivery, we pride ourselves on providing customized, full-service offerings to our clients.


PCB Assembly Manufacturing Service
Double-sided, Multi-layer Printed Circuit Boards, Rigid and flexible Circuit board, FPC
Prototype, Pre-production and Medium to High Volume Production.
24 Hours Rush Delivery
Electrical Testing
Anti-bag packing

Testing Procedures for PCB Assembly Manufacturing 
We perform multiple strict quality assuring procedures before shipment
Visual Inspection
Flying probe
Bed of nails
Impedance control
Solder-ability detection
Digital metallographic microscope
AOI (Automated Optical Inspection) 

Standard Component Sourcing Service
Supplier → Components Purchase → IQC → Protection Control → Material Supply → Firmware
PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly


Production Capability
We have a production capability for standard and HDI , Rigid, RF and high frequency  PCBs, together with throught hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities. 


PCB Production Capability

PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly


PCBA Capability
PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly



Factory Equipment
PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly


Product Show
PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly





Quality Control and Certification
PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly


PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly



Package and Shipment

Common packaging:

PCB:  Sealed bag, Anti-static bags, Suitable carton.
PCBA:  Antistatic foam bags, Anti-static bags, Suitable carton.

PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly


For the shipping, you can choose any express companies you have with your account, or our account, for heavier packages, seaway shipping is also available.


PCBA 01005/0201 BGA 0.2mm X-ray Test High Quality SMT/DIP Assembly


Trade Term:
1. Payment: T/T, LC,DA,DP,Paypal.
2. Lead time: 7-10 working days for normal projects
3. Sample can be available within 7 working days
4. Shipping freight is quoted under your requests
5. Shipping port:  Shenzhen or HongKong
6. Discount is offered at large order quantities