China PCB Board Printed Circuit Board Assembly with BGA Balls, Find details about China PCB Circuit Board, PCB Board Assembly from PCB Board Printed Circuit Board Assembly with BGA Balls
Items | Parameter | Special | ||
Layers Counts | 2-20 | |||
Board material | FR-4,Aluminum | High Tg FR4 | ||
max Fabrication area | 580×700mm | 500mm×3000mm | ||
Board thickness | 0.1-3.2mm | |||
Camber | Double Side multi -layers | d ≤0.075mm d ≤1% | d≤0.05mm | |
Impedance | ±7% | ±5% | ||
PTH tolerance | d>5.0 | ±0.076mm | ||
0.3<d≤5.0 | ±0.05mm | |||
d≤0.3 | ±0.08mm | |||
Min finished hole size | 0.15mm | |||
Hole copper thickness | ≥20um | |||
Min track width, spacing | 0.05mm ×0.05mm | |||
Profile size | ±0.1mm | ±0.05mm | ||
Profile | Routing,Punch,Cut,V-cut,Chanfer | |||
Surface finish | Immersion Gold:0.025~0.075um | |||
Gold finger:≥0.13 um | ≥1.0 um | |||
OSP:0.2-0.5µm | ||||
HAL:5~20 um | ||||
LEADFREE HAL:5~20 um | ||||
Surface plating | Solder mask: Black Green White Red Thickness≥17 um,Block,BGA | |||
Character : Black Yellow Green White style: Highness≥0.0.625mm Width≥0.125mm | ||||
Ppeelable mask: red bule thickness≥300 um | ||||
Carbonink : Black thickness≥25 um Highness≥0.30mm Width≥0.3mm |