China Quick Turn Multi-Layers PCB Immersion Gold BGA Impedance PCB Multi-Layer PCB/PCBA Assembly Design and Reverse Engineering Services, Find details about China PCB, PCBA from Quick Turn Multi-Layers PCB Immersion Gold BGA Impedance PCB Multi-Layer PCB/PCBA Assembly Design and Reverse Engineering Services
Layer: | 1-40 layer |
Surface: | HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. |
Copper thickness: | 0.25 Oz -12 Oz |
Material: | FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers |
Board thickness | 0.1 to 6.0mm(4 to 240mil) |
Minimum line width/space | 0.076/0.076mm |
Minimum line gap | +/-10% |
Outer layer copper thickness | 140um(bulk) 210um(pcb prototype) |
Inner layer copper thickness | 70um(bulk) 150um(pcb protytype) |
Min.finished hole size(Mechanical) | 0.15mm |
Min.finished hole size (laser hole) | 0.1mm |
Aspect ratio | 10:01(bulk) 13:01(pcb prototype) |
Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey |
Tolerance of dimension size | +/-0.1mm |
Tolerance of board thickness | <1.0mm +/-0.1mm |
Tolerance of finished NPTH hole size | +/-0.05mm |
Tolerance of finished PTH hole size | +/-0.076mm |
Delivery time | Mass:10~12d/ Sample:5~7D |
Capacity | 35000sq/m |
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