4 Layer PCB Board Immersion Gold Lead-Free Circuit Board

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4 Layer PCB Board Immersion Gold Lead-Free Circuit Board

4 Layer PCB Board Immersion Gold Lead-Free Circuit Board

China 4 Layer PCB Board Immersion Gold Lead-Free Circuit Board, Find details about China Battery PCB, Fr4 1.6mm PCB from 4 Layer PCB Board Immersion Gold Lead-Free Circuit Board

Basic Info.

Insulation Materials

Organic Resin

Min. Hole Size

0.2mm

Min. Line Width&Spacing

0.1mm/0.1mm

Solder Mask Color

Green/Black/White/Blue/Yellow/Red

Certificates

UL, RoHS, SGS, ISO9001 ISO14000

Shipping

DHL, UPS, TNT, FedEx, etc

Transport Package

by Vacuum Packing in Cartons

Origin

Shenzhen

HS Code

85340090

Insulation Materials

Organic Resin

Min. Hole Size

0.2mm

Min. Line Width&Spacing

0.1mm/0.1mm

Solder Mask Color

Green/Black/White/Blue/Yellow/Red

Certificates

UL, RoHS, SGS, ISO9001 ISO14000

Shipping

DHL, UPS, TNT, FedEx, etc

Transport Package

by Vacuum Packing in Cartons

Origin

Shenzhen

HS Code

85340090

Product Desciption

Product Description
Quick lead time PCBA with high quality
RoHS complaint PCB
Lead free/Immersion Gold/Silver/Tin technology
UL approved

Our Capacit

No	Items	Production Capability
1	PCB Counts	1 ~ 50 layers
2	Material Type	FR4,High TG , CEM1,CEM3,PTFE,Aluminum Base,Arlon,Rogers,Halogen free
3	Maximum Panel Size	500mmx1200mm
4	Board Outline Tolerance	Routing:±0.13mm ;Punching:±0.05mm
5	Finished Board Thickness	0.20mm--6.00mm
6	Finshed Board Thickness Tolerance	>=0.8mm : ±8% ; <0.8mm: ±10%
7	Minimum Trace Width/Space	0.003" /0.003"
8	Finished Outer Copper Thickness	1OZ---5OZ
9	Finshed Inner Cooper Thickness	0.50OZ--5OZ
10	Finished Hole Size	0.10mm--6.30mm
11	Hole Size Tolerance	NPTH: ±0.05mm ; PTH: ±0.076mm
12	Hole Location Registration(Mechanical)	±0.08mm
13	Aspect Ratio	13:01
14	Solder Mask Type	LPI
15	SMT Mini.Solder Mask Width	0.08mm
16	Plug Via Diameter	0.25mm--0.60mm
17	Impedance Control Tolerance	±5%
18	Surface Treatment Type	HASL;HASL+Lead Free;Immersion Gold;Immersion Tin;Flash Gold; OSP;Immersion Silver;Gold Finger;Carbon Ink;Peelable Mask

Feature		Laser via PCB capability
		Mass production			Sample Run(Small Value)
		(Normal lower cost)	(High Value normal)	(High Value higher cost)
Line /space width (trace layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Line /space width (HDI layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Drill via size (PTH)		.010"	.010"	.010"	.008"
Drill capture pad (PTH)		.022"	.020"	.018"	.016"
Micro via size (unfinished)	RCC	.004"	.004"	.004"	. 003"
Micro capture pad		.014"	.012"	.011"	.009"
Micro via size (unfinished)	PP	.005"	.004"	.004"	.003"
Micro capture pad		.014"	.012"	.011"	.010"
Aspect ratio (PTH)		8:01	9:01	10:01	11:01
Aspect ratio (Micro via)		0.6:1	0.8:1	0.9:1	1:01
Layer to layer Registration		±5mil	±4mil	±3mil	±2mil
Impedance control		±10%(±5Ω)	±10%(±4Ω	±7%(±3Ω)	±5%(±2.5Ω)

4 Layer PCB Board Immersion Gold Lead-Free Circuit Board
Our service

Feature		Laser via PCB capability
		Mass production			Sample Run(Small Value)
		(Normal lower cost)	(High Value normal)	(High Value higher cost)
Line /space width (trace layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Line /space width (HDI layers)		.005"/.005"	.004"/.004"	.003"/.003"	.0025"
Drill via size (PTH)		.010"	.010"	.010"	.008"
Drill capture pad (PTH)		.022"	.020"	.018"	.016"
Micro via size (unfinished)	RCC	.004"	.004"	.004"	. 003"
Micro capture pad		.014"	.012"	.011"	.009"
Micro via size (unfinished)	PP	.005"	.004"	.004"	.003"
Micro capture pad		.014"	.012"	.011"	.010"
Aspect ratio (PTH)		8:01	9:01	10:01	11:01
Aspect ratio (Micro via)		0.6:1	0.8:1	0.9:1	1:01
Layer to layer Registration		±5mil	±4mil	±3mil	±2mil
Impedance control		±10%(±5Ω)	±10%(±4Ω	±7%(±3Ω)	±5%(±2.5Ω)

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