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Multi Layer Immersion Gold PCB

China Multi Layer Immersion Gold PCB, Find details about China Pcb, Printed Circuit Board from Multi Layer Immersion Gold PCB

Model NO.
Multilayer PCB -32
PP Thickness
7628(0.18mm) 2116(0.12mm) 1080(0.08mm)
Core Base Board
0.3mm 0.5mm 0.6mm 0.8mm 1.0mm
Sample Date
5-7days
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Trademark
ZAPON
Transport Package
Vacuum Packing
Specification
UL ISO TS16949 IPC Standard
Origin
China
HS Code
85340090
Model NO.
Multilayer PCB -32
PP Thickness
7628(0.18mm) 2116(0.12mm) 1080(0.08mm)
Core Base Board
0.3mm 0.5mm 0.6mm 0.8mm 1.0mm
Sample Date
5-7days
Shipment
Air,Sea,Express(DHL TNT FedEx EMS UPS)
Trademark
ZAPON
Transport Package
Vacuum Packing
Specification
UL ISO TS16949 IPC Standard
Origin
China
HS Code
85340090
ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.

The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
ItemCapabilities
Number of LayersFrom 4-layer to 22- Layer
MaterialFR-4,HighTg, Rogers
Halogen Free
PCB ThicknessMin.thickness0.4mm(16mil)
Max.thickness3.2mm(128mil)

Surface finished		Gold Plating
Immersion Gold(Silver)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder MaskGreen,White,Black,Yellow,Red,Blue
Other printingGold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness1/ 2 oz (18 μm) - 4 oz (140 μm)
Min. Finished Hole Size0.2mm(8mil)
Hole Size Tolerance (PTH)+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)+/-0.05mm (2 mil)
Min. Line Width and Spacing0.1mm (4 mil)
Min. Solder Mask Clearance0.05mm (2 mil)
Min. Annular Ring0.076mm (3mil)
Profile and V-CutCNC-Routing, Stamping and Beveling,V-CUT,CNC
 
Special ProcessMicro-section, Chamfer for Gold Finger
   File format  Gerber file , CAM350 ,Protel,PowerPCB
   E-TESTFlying Prob , E-test ,Fixture
  Other Test  Impedance , Slice up
  Warp & Twist ≤0.7%

 

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