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Rosh Compliant PCB Assembly Shenzhen Local EMS

China Rosh Compliant PCB Assembly Shenzhen Local EMS, Find details about China Circuit Board, Rigid Circuit Board from Rosh Compliant PCB Assembly Shenzhen Local EMS

Model NO.
IBE-004
Condition
New
Trademark
IBE
Transport Package
ESD Bag + Bubble Bag + Carton Box
Specification
UL, ROHS, IPC-A-610E Class II
Origin
Shenzhen, China
HS Code
85340900
Model NO.
IBE-004
Condition
New
Trademark
IBE
Transport Package
ESD Bag + Bubble Bag + Carton Box
Specification
UL, ROHS, IPC-A-610E Class II
Origin
Shenzhen, China
HS Code
85340900
Information Needed for Quick Quote for PCB: 

1,Gerber file
2,QTY, board material, Finished board thickness, finished copper thickness, surface finished
3,Other special requirement

 
Professional Eletronics Contract Manufacturer

Established in 1998, IBE Group is a professional Electronics Contract manufacturer, specialized in turn-key solution including electronics design, PCB manufacturing, SMT and PCB Assembly, components sourcing, prototyping, testing etc.
 
We are dedicated to deliverying highly cost-effective and satisfactory products and services to our diverse customers.
 
What IBE serves for:
Industry control
Automotive Electronics
Medical Care
Consumer Electronics
Telecom and Security
Metering and Instrument
Energy
LED lighting and display
 
Standard
 
IS09001-2008 and ISO14001:2004.
UL certificated :E326838
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
 

PCB Testings:


How IBE Group forms:

Factory view:
 
PCB Manufacturing Capability
PCB Layers:1Layers to 18 layer (Max)
Board thickness:0.13~6.0mm
Min line width/space:3mil 
Min mechanical hole size:4mil
Copper thickness:9um~210um(0.25oz~6oz)
Max aspect ratio:1:10
Max board size:400*700mm
Surface Finish:HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask 
Material:FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. 
  
PCB Assembly Capability
Stencil size range:1560*450mm 
Min SMT package:0402/1005(1.0x0.5mm)
Min IC pitch:0.3mm 
Max PCB Size:1200*400mm 
Min PCB thickness:0.35mm 
Min Chip Size:01005
Max BGA Size:74*74mm 
BGA Ball Pitch:1.00~3.00mm 
BGA Ball Diameter: 0.4~1.0mm
QFP Lead Pitch:0.38~2.54mm 
Testing :ICT,AOI,X-RAY,Funtional test etc.

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