Non RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder Paste

China Non RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder Paste, Find details about China Rma Solder Paste, Rosin Core Flux Paste from Non RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder Paste

Model NO.
Tin Lead Solder Paste
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application
SMT
Application 2
SMD
Trademark
XF Solder
Transport Package
Foam Box
Specification
100g to 1000g
Origin
China
HS Code
3810100000
Model NO.
Tin Lead Solder Paste
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application
SMT
Application 2
SMD
Trademark
XF Solder
Transport Package
Foam Box
Specification
100g to 1000g
Origin
China
HS Code
3810100000
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

Non RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder PasteNon RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder PasteNon RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder PasteNon RoHS Rma Rosin Core Flux Tin Lead Mobile IC Reballing Solder Paste