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BGA Syringe Tin Solder Paste

China BGA Syringe Tin Solder Paste, Find details about China Syringe Solder Paste, Syringe Tin Paste from BGA Syringe Tin Solder Paste

Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application
SMT
Application 2
SMD
Trademark
XF Solder
Transport Package
Foam Box
Specification
100g to 1000g
Origin
China
HS Code
3810100000
Powder Size
Type 3: 25 to 45 Microns
Powder Size 2
Type 4: 20 to 38 Microns
Flux
No Clean Flux
Alloy 2
Sn63pb37
Alloy 3
Sn60pb40
Alloy 4
Sn55pb45
Alloy 5
Sn50pb50
Packing
Jar
Packing 2
Syringe
Shipping
Courier / Air Freight
Shelf Life
6months
Storage
0 to 10 Degree Celsius
Application
SMT
Application 2
SMD
Trademark
XF Solder
Transport Package
Foam Box
Specification
100g to 1000g
Origin
China
HS Code
3810100000
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc

BGA Syringe Tin Solder PasteBGA Syringe Tin Solder PasteBGA Syringe Tin Solder PasteBGA Syringe Tin Solder Paste

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