BGA PCB Printed Circuit Board PCB for Electronics Assembly
China BGA PCB Printed Circuit Board PCB for Electronics Assembly, Find details about China PCB, PCBA from BGA PCB Printed Circuit Board PCB for Electronics Assembly
Basic Info.
Model NO.
UC-5676
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Uc
Layer Count
8 Layers
Finished Copper Thickness
All 35um
Board Thickness
2.0mm
Thickness Material
Fr4
Surface Finish
Enig
Soldermask Color
Red
Specialities
BGA,Controlled Impedance
PCB Testing
E-Testing, Flying Probe Testing
Ipc Standards
Ipc Class II
Lead Time
9 Working Days
Trademark
UC
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO9001. RoHs, TS, SGS
Origin
Shenzhen, China
HS Code
8534001000
Model NO.
UC-5676
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Uc
Layer Count
8 Layers
Finished Copper Thickness
All 35um
Board Thickness
2.0mm
Thickness Material
Fr4
Surface Finish
Enig
Soldermask Color
Red
Specialities
BGA,Controlled Impedance
PCB Testing
E-Testing, Flying Probe Testing
Ipc Standards
Ipc Class II
Lead Time
9 Working Days
Trademark
UC
Transport Package
Vacuum Package
Specification
UL(US&Canada). ISO9001. RoHs, TS, SGS
Origin
Shenzhen, China
HS Code
8534001000
Product Desciption
Ucreate LTD PCB's aim
Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
4.Products Equipment
Customer Satisfaction is Always Our First Priority!
*Quality Policy
*Top Quality and high efficiency
*Improve continuously
*Achieve customer's satisfaction
1.Products Application
2. Market Distribution
3.Technical Capabilities
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
| Hole precision | ±2 mil(±50 um) | ||
| tolerance for Slot | ±3 mil(±75 um) | ||
| tolerance for PTH | ±3 mil(±75um) | ||
| tolerance for NPTH | ±2mil(±50um) | ||
| Max Aspect Ratio for PTH | 8:1 | ||
| Hole wall copper thickness | 15-50um | ||
| Alignment of outer layers | 4mil/4mil | ||
| Min trace width/space for outer layer | 4mil/4mil | ||
| Tolerance of Etching | +/-10% | ||
| Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |
| at trace corner | ≥0.2mil(5um) | ||
| On base material | ≤+1.2mil Finished thickness | ||
| Hardness of solder mask | 6H | ||
| Alignment of solder mask film | ±2mil(+/-50um) | ||
| Min width of solder mask bridge | 4mil(100um) | ||
| Max hole with solder plug | 0.5mm | ||
| Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||
| bow and twist | 0.75% | ||
4.Products Equipment
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