Customized OEM ODM PCB & PCBA Assembly Manufacturer
China Customized OEM ODM PCB & PCBA Assembly Manufacturer, Find details about China Printed Circuit Board, Flexible Printed Circuit Board from Customized OEM ODM PCB & PCBA Assembly Manufacturer
Basic Info.
Model NO.
okeypcba
Condition
New
Trademark
OKEY
Transport Package
Inner Vacuum Packing and Outer by Cartons
Specification
FR4, 1.6mm, multiLayer, 1OZ Copper Thickness
Origin
Guangdong Shenzhen, China
HS Code
85340090
Model NO.
okeypcba
Condition
New
Trademark
OKEY
Transport Package
Inner Vacuum Packing and Outer by Cartons
Specification
FR4, 1.6mm, multiLayer, 1OZ Copper Thickness
Origin
Guangdong Shenzhen, China
HS Code
85340090
Product Desciption
| Technical Capabilities | |||
| Items | Speci. | Remark | |
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||
| Max. Board size | 2000×610mm | ||
Min. board Thickness | 2-layer 0.15mm | ||
| 4-layer 0.4mm | |||
| 6-layer 0.6mm | |||
| 8-layer 1.5mm | |||
| 10-layer 1.6~2.0mm | |||
| Min. line Width/Space | 0.1mm(4mil) | ||
| Max. Copper thickness | 10OZ | ||
| Min. S/M Pitch | 0.1mm(4mil) | ||
| Min. hole size | 0.2mm(8mil) | ||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||
| Hole position deviation | ±0.05mm(2mil) | ||
| Outline tolerance | ±0.10mm(4mil) | ||
| Twist & Bent | 0.75% | ||
| Insulation Resistance | >10 12 Ω Normal | ||
| Electric strength | >1.3kv/mm | ||
| S/M abrasion | >6H | ||
| Thermal stress | 288°C 10Sec | ||
| Test Voltage | 50-300V | ||
| Min. blind/buried via | 0.15mm (6mil) | ||
Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||
Materials | FR4,H- TG,Teflon,Rogers,Ceramics,Aluminium, Copper base | ||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |
| Inner copper thickness | 1~4 oz | ||
| Outer copper thickness | 0.5~6 oz | ||
| Finished board thickness | 0.4-3.2 mm | ||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L |
| ±10% | ±10% | 6~8 L | |
| ±10% | ±10% | ≥10 L | |
| Inner layer treatment | brown oxidation | ||
| Layer count Capability | 1-30 LAYER | ||
| alignment between ML | ±2mil | ||
| Min drilling | 0.15 mm | ||
| Min finished hole | 0.1 mm | ||
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