China Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL, Find details about China PCB, Mother Board from Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL
Capability for Rigid PCB Production | ||
NO. | ITEM | TECHNICAL DATA |
1 | Types of Products | Multilayer PCB, Buried/Blind Via PCB, High Frequency PCB, Rigid-Flexible PCB, Teflon Board, HDI, Aluminum Base PCB. |
2 | Materials | FR-4, Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, Black FR4 |
3 | Layers | 2-32(layers) |
4 | Max Board Size | 450 x 660mm 18" x 26" |
5 | Min Board Thickness | 4(layers) 0.40mm 16mil |
6(layers) 0.80mm 32mil | ||
8(layers) 1.00mm 40mil | ||
10(layers) 1.20mm 48mil | ||
6 | Copper Clad(Max.) | 20oz(outer) / 4oz(inner) |
7 | Min line Width/space | 0.075mm 3mil |
8 | Drill Size Mechanical (min) | 0.20mm 8mil |
9 | Drill Size Laser(min) | 0.10mm 4mil |
10 | PTH Wall Thickness | 0.020mm 0.8mil |
11 | PTH dia tolerance | ±0.075mm ±3mil |
12 | NPTH hole dia tolerance | ±0.05mm ±2mil |
13 | Hole Position Deviation | ±0.05mm ±2mil |
14 | Outline Tolerance | ±0.10mm ±4mil |
15 | S/M Pitch | 0.08mm 3mil |
16 | Insulation Resistance | 1E+12Ω(Normal) |
17 | Test Voltage | 50~300V |
18 | Aspect ratio | 8:1 |
19 | Thermal Shock | 3x10Sec@288 ºC |
20 | Warp and Twist | ≤0.75% |
21 | Current breakdown | 10A |
22 | Electric Strength | >1.3KV/mm |
23 | Peel Strength | 1.4N/mm |
24 | Solder Mask Abrasion | ≥6H |
25 | Flammability | 94V-0 |
26 | Impedance Control | ±10% |
27 | Buried Via | Yes |
28 | Blind Via | Yes |
29 | HDI | 2+N+2 4mil Via hole |
30 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL Free |