Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL

China Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL, Find details about China PCB, Mother Board from Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL

Model NO.
8layer pcb
Condition
Used
Special 1
Resin Plug Hole
Mini Hole Copper
25um
Mini Hole
0.15mm
Mini Width/Space
4/4mil
Board Thickness
1.6mm
Soldermask
Green
Silkscreen
White
Finish
Immersion Gold 3u"
Trademark
Coenrichpcb
Transport Package
Vacumme
Specification
200mm x 208mm
Origin
Made in China
HS Code
8534001000
Model NO.
8layer pcb
Condition
Used
Special 1
Resin Plug Hole
Mini Hole Copper
25um
Mini Hole
0.15mm
Mini Width/Space
4/4mil
Board Thickness
1.6mm
Soldermask
Green
Silkscreen
White
Finish
Immersion Gold 3u"
Trademark
Coenrichpcb
Transport Package
Vacumme
Specification
200mm x 208mm
Origin
Made in China
HS Code
8534001000
 
Company Profile

Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL

Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.



Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%


Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%

 
 
Detailed Photos

Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL

Capability

 

       Capability for Rigid PCB Production
NO.ITEMTECHNICAL DATA
1Types of ProductsMultilayer PCB, Buried/Blind Via PCB, High Frequency PCB,
Rigid-Flexible PCB, Teflon Board, HDI, Aluminum Base PCB.
2MaterialsFR-4, Copper core,  Getek , Rogers, Aluminum core,  High TG, Teflon, Black FR4
3Layers2-32(layers)
4Max Board Size450 x 660mm 18" x 26"
5Min Board Thickness4(layers) 0.40mm 16mil
6(layers) 0.80mm 32mil
8(layers) 1.00mm 40mil
10(layers) 1.20mm 48mil
6Copper Clad(Max.)20oz(outer) / 4oz(inner)
7Min line Width/space0.075mm 3mil
8Drill Size Mechanical (min)0.20mm 8mil
9Drill Size Laser(min)0.10mm 4mil
10PTH Wall Thickness0.020mm 0.8mil
11PTH dia tolerance±0.075mm ±3mil
12NPTH hole dia tolerance±0.05mm ±2mil
13Hole Position Deviation±0.05mm ±2mil
14Outline Tolerance±0.10mm ±4mil
15S/M Pitch0.08mm 3mil
16Insulation Resistance1E+12Ω(Normal)
17Test Voltage50~300V
18Aspect ratio8:1
19Thermal Shock3x10Sec@288 ºC
20Warp and Twist≤0.75%
21Current breakdown10A
22Electric Strength>1.3KV/mm
23Peel Strength1.4N/mm
24Solder Mask Abrasion≥6H
25Flammability94V-0
26Impedance Control±10%
27Buried ViaYes
28Blind ViaYes
29HDI2+N+2 4mil Via hole
30Surface FinishedENIG, ImAg, ImSn, OSP, HASL Free

 

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Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL
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Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL
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Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL
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Immersion Gold 3u" 8layer PCBA Motherboard with UL cUL