Customized High Quality Plating Gold PCB

China Customized High Quality Plating Gold PCB, Find details about China OSP PCB Circuit Board, Circuit Board from Customized High Quality Plating Gold PCB

Model NO.
Okey-am-0523-12
Base Material
Aluminum
Insulation Materials
Organic Resin
Model
PCB
Color
Green, Blue, Black, Red, Yellow etc.
Certificate
ISO UL RoHS and Reach
Surface Finish
Lead Free HASL
Trademark
OKEY
Transport Package
Inner Vacuum Packing Outer Carton Box
Specification
UL, Rohs, ISO9001: 2008
Origin
Shenzhen, Guangdong, China
HS Code
8534009000
Model NO.
Okey-am-0523-12
Base Material
Aluminum
Insulation Materials
Organic Resin
Model
PCB
Color
Green, Blue, Black, Red, Yellow etc.
Certificate
ISO UL RoHS and Reach
Surface Finish
Lead Free HASL
Trademark
OKEY
Transport Package
Inner Vacuum Packing Outer Carton Box
Specification
UL, Rohs, ISO9001: 2008
Origin
Shenzhen, Guangdong, China
HS Code
8534009000
Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Max. Board size2000×610mm 


Min. board Thickness
2-layer 0.15mm 
4-layer 0.4mm 
6-layer 0.6mm 
8-layer 1.5mm 
10-layer 1.6~2.0mm 
Min. line Width/Space0.1mm(4mil) 
Max. Copper thickness10OZ 
Min. S/M Pitch0.1mm(4mil) 
Min. hole size0.2mm(8mil) 
Hole dia. Tolerance (PTH)±0.05mm(2mil) 
Hole dia. Tolerance,+0/-0.05mm(2mil) 
Hole position deviation±0.05mm(2mil) 
Outline tolerance±0.10mm(4mil) 
Twist & Bent0.75% 
Insulation Resistance>10 12 Ω Normal 
Electric strength>1.3kv/mm 
S/M abrasion>6H 
Thermal stress288°C 10Sec 
Test Voltage50-300V 
Min. blind/buried via0.15mm (6mil) 

Surface Finished
HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold 

Materials
FR4,H-
TG,Teflon,Rogers,Ceramics,Aluminium, Copper base
 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control
±0.10 mm±0.10 mm
1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH08:01 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 

Min trace width/space for outer layer

4mil/4mil
 
Tolerance of Etching+/-10% 

Thickness of solder mask
on trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil 
Finished thickness
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 

Surface finish
HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger,
Electric Gold, OSP, Immersion Silver.
 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist0.75% 

Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB
Customized High Quality Plating Gold PCB

Pcb circuit board with double sided soldermask:

Top quality bare pcb with cheapest price made in China

1. PCB layer: 1-12 layers
2. PCB Certificate: ISO UL REACH and RoHS
3. FR-4 Material
4. Best price with excellent after-service
5. Reputable manufacturer

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NOItemTechnical capabilities
1Layers1-12 layers
2Max. Board size2000×610mm
3Min. board Thickness2-layer  0.25mm
4-layer  0.6mm
6-layer  0.8mm
8-layer  1.5mm
10-layer  1.6~2.0mm
4Min. line Width/Space0.15mm(4-5mil)
5Max. Copper thickness10OZ
6Min. S/M Pitch0.15mm(4-5mil)
7Min. hole size0.2mm(8mil)
8Hole dia. Tolerance (PTH)±0.05mm(2mil)
9Hole dia. Tolerance (NPTH)+0/-0.05mm(2mil)
10Hole position deviation±0.05mm(2mil)
11Outline tolerance±0.10mm(4mil)
12Twist & Bent0.75%
13Insulation Resistance>10 12 Ω Normal
14Electric strength>1.3kv/mm
15S/M abrasion>6H
16Thermal stress288°C10Sec
17Test Voltage50-300V
18Min. blind/buried via0.2mm  (8mil)
19Surface FinishedHAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold
20MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base