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Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB
Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB

Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB

China Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB, Find details about China Flex PCB, Flexible PCB from Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB

Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Organic Resin
Board Material
Polyimide
Copper Thickness
1oz
Board Thickness
0.8mm
Min. Hole Size
0.2mm
Min. Line Width
01mm
Min. Line Spacing
0.09mm
Surface Finishing
Enig
Is_Customized
Yes
Trademark
FL
Transport Package
Vacuum+Carton Packing
Specification
RoHS, ISO9001, UL
Origin
China
HS Code
8534009000
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Organic Resin
Board Material
Polyimide
Copper Thickness
1oz
Board Thickness
0.8mm
Min. Hole Size
0.2mm
Min. Line Width
01mm
Min. Line Spacing
0.09mm
Surface Finishing
Enig
Is_Customized
Yes
Trademark
FL
Transport Package
Vacuum+Carton Packing
Specification
RoHS, ISO9001, UL
Origin
China
HS Code
8534009000
China professional flexible pcb and Rigid flex pcb board FPC manuafcturer
 

Product Description

Commodity Introduction

This is a type of polyimide PCB for the application of Sensor. It's a single sided layer board at
0.1mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed
separately. 


 
Parameters & Data Sheet
PCB SIZE95x 43mm=1PCS
BOARD TYPE 
Number of Layersdouble
Surface Mount ComponentsYES
Through Hole Componentsno
LAYER STACKUPcopper ------- 35um(1oz)
Polyimide 0.1mm
TECHNOLOGY 
Minimum Trace and Space:12mil/12mil
Minimum / Maximum Holes:2.5mm
Number of Different Holes:1
Number of Drill Holes:2
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance ControlNO
BOARD MATERIAL 
Glass Epoxy: Polyimide 0.1mm, FPC
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 0.1mm ±0.05
PLATING AND COATING 
Surface FinishElectroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel)
Solder Mask Apply To: TOP
Solder Mask Color: Yellow, Coverlay
Solder Mask Type:LPSM
CONTOUR/CUTTINGLaser cut
MARKING 
Side of Component LegendTOP
Colour of Component LegendWhite, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and 
leged FREE AREA
VIANone Plated Through Hole(NPTH)
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE 
Outline dimension:  0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST100% Electrical Test prior shipment
APPLICATION:Bluetooth, Converters
Portable Router
3G Speed
4G Speed
GPS For Car
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.
 
  
  
  
  
  
  
  

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Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB

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Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB
Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB

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Shenzhen Customized Immersion Gold HDI Printed Circuit Board Manufacturing PCB




Contact us:

Web: fastlinepcb.en.made-in-china.com

 

 

 

 

 

 

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