China 8layer Digital Photo Frame Prototype PCB Board PCB Assembly, Find details about China Printed Circuit Board, PCB Board from 8layer Digital Photo Frame Prototype PCB Board PCB Assembly
PCB capability and services:
1.Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2.Flexible PCB (up to 10 layers)
3.Rigid-flex PCB (up to 8 layers)
4.CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5.HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6.Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7.Quantities range from prototype to volume production.
8.100% E-Test
Detailed Specification of PCB Manufacturing
1 | Layer | 1-30 layer |
2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
3 | Board thickness | 0.2mm-6mm |
4 | Max.Finished board size | 800*508mm |
5 | Min.Drilled hole size | 0.25mm |
6 | Min.Line width | 0.075mm(3mil) |
7 | Min.Line spacing | 0.075mm(3mil) |
8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | Green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing,Plastic bag |
12 | Outer packing | Standard carton packing |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
15 | Profiling punching | Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
1 | Type of Assembly | SMT and Thru-hole |
2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
3 | Components | Passives Down to 0201 Size |
BGA and VFBGA | ||
Leadless Chip Carries/CSP | ||
Double-Sided SMT Assembly | ||
Fine Pitch to 08 Mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement-Same Day Service | ||
3 | Bare Board Size | Smallest:0.25x0.25 Inches |
Largest:20x20 Inches | ||
4 | File Formats | Bill of Materials |
Gerber Files | ||
Pick-N-Place File(XYRS) | ||
5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment |
6 | Component Packaging | Cut Tape |
Tube | ||
Reels | ||
Loose Parts | ||
7 | Turn Time | 15 to 20 days |
8 | Testing | AOI inspection |
X-Ray inspection | ||
In-Circuit testing | ||
Functional tesQuality Assurance: |
Quotation Requirement :
Following specifications are needed for quotation:
1) Base material:
2) Board thickness:
3) Copper thickness:
4) Surface treatment:
5) Color of solder mask and silkscreen:
6) Quantity
7) Gerber file &BOM