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Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering

China Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering, Find details about China SMT Reflow Oven, Leadfree Reflow Oven from Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering

Model NO.
T8L
Model
T8l
Zone Qty
8
Peak Power
12kw
Working Power
5kw
Voltage
380/ 220V
Width of Conveyor
300mm
Standard Soldering Height
25mm
Outsize of Machine
2200X800X1220mm
Fast Speed
1200mm
Trademark
NeoDen
Transport Package
Fumigation-Free Wooden Case
Specification
5 heating zone
Origin
Zhejiang
HS Code
8515809090
Model NO.
T8L
Model
T8l
Zone Qty
8
Peak Power
12kw
Working Power
5kw
Voltage
380/ 220V
Width of Conveyor
300mm
Standard Soldering Height
25mm
Outsize of Machine
2200X800X1220mm
Fast Speed
1200mm
Trademark
NeoDen
Transport Package
Fumigation-Free Wooden Case
Specification
5 heating zone
Origin
Zhejiang
HS Code
8515809090
SMD reflow oven- 8 heating zone version T8L

Used for electric components soldering in SMT production line, LED, high precision IC, scale board solering assembly.
 
Product Parameters

 

ParametersT8LT5LT8(desktop)T5(desktop)T5S(desktop)
L*W*H(mm)2100x712x12201800x600x12202100x712x5001800x600x5001400x555x375
N.W.(KG)230160180130100
Peak power(KW)11.67.811.67.85.8
Working power(KW)53.553.52
Voltage(V)380/220380/220380/220380/220380/220
Conveyor width(mm)300300300300300
Available height(mm)2525252525
Max.conveyor speed (mm/min)10001000100010001000
Heating area length (mm)1210100012101000900
T5  Five zonesFirst/ Forth:Fast preheating zone
Second:Drying zone
Third/Fifth:Soldering zone
Fourth/Fifth:Bottom-side heating zone
(Each zones adapts independent heating/cooling control ways,cooling zone belongs to strong wind refrigerating system.)
T8  Eight zonesFirst/Fifth:Fast preheating zone
Second/Third/Sixth/Seventh:Drying zone
Forth/Eighth:Soldering zone
Fifth/Sixth/Seventh/Eighth:Bottom-side heating zone
(Each zones adapts independent heating/cooling control ways,cooling zone belongs to strong wind refrigerating system.)

Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering
Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering
Overseas Exhibition

Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering
Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering
 

FAQ

What is reflow soldering

The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board.
The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.

What is a brief SMT process

Preparation board/ solder paste→ Screen printing→ Component placement→ Component inspection→ Reflow soldering→ Cleaning→ Solder joint inspection→ Cicuit testing→ Packaging → Finish.

Pb-Free SMD Soldering Oven T8l with 8 Heating Zones for IC, BGA Soldering

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