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2 Layers PCB with Component Assembly

China 2 Layers PCB with Component Assembly, Find details about China Circuit Board, Power Circuit Board from 2 Layers PCB with Component Assembly

Model NO.
IBE-P1468
Trademark
IBE
Transport Package
Standard Carton
Specification
UL, ROHS, IPC-A-610E Class II
Origin
Shenzhen, China
HS Code
85340900
Model NO.
IBE-P1468
Trademark
IBE
Transport Package
Standard Carton
Specification
UL, ROHS, IPC-A-610E Class II
Origin
Shenzhen, China
HS Code
85340900
Multi Layer PCB Board Assembly with UL certificate

Your reliable EMS partner----IBE!
IBE Specialized in PCB manufacturing and and PCB Assembly since 1998.

2 Layers PCB with Component Assembly

1. One stop services:
2. PCB layout
3. Electronic design
4. Engineering
5. PCB fabrication
6. PCB Assembly
7. Box Build
8. IC Programming
9. Testing
10. Parts sourcing
11. Supply management
12. After sales servies etc.

2 Layers PCB with Component Assembly
Certificate:
IPC Standard
ISO9001
ISO14001
UL Certificated: E326838
ISO/TS16949 and ISO13485 undering approval, may finished in September

2 Layers PCB with Component Assembly

Testing and value added services:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming

2 Layers PCB with Component Assembly2 Layers PCB with Component Assembly2 Layers PCB with Component Assembly

Rich experience for SUPPLY CHAIN MANAGEMENT for components, moldings, stamping, plastic injection parts etc.

Your enquiries will be welcome!
PCB Manufacturing Capability
PCB Layers:1Layers to 18 layer (Max)
Board thickness:0.13~6.0mm
Min line width/space:3mil 
Min mechanical hole size:4mil
Copper thickness:9um~210um(0.25oz~6oz)
Max aspect ratio:1:10
Max board size:400*700mm
Surface Finish:HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask 
Material:FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. 
  
PCB Assembly Capability
Stencil size range:1560*450mm 
Min SMT package:0402/1005(1.0x0.5mm)
Min IC pitch:0.3mm 
Max PCB Size:1200*400mm 
Min PCB thickness:0.35mm 
Min Chip Size:01005
Max BGA Size:74*74mm 
BGA Ball Pitch:1.00~3.00mm 
BGA Ball Diameter: 0.4~1.0mm
QFP Lead Pitch:0.38~2.54mm 
Testing :ICT,AOI,X-RAY,Funtional test etc.

More details or RFQ pls contact Fannie Yu:
 
 
 
 

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