Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate

China Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate, Find details about China Ceramic Substrate with Copper Coating, Alumina Ceramic Substrate from Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate

Model NO.
OEM
Feature
High Heat Conductivity
Keyword
Direct Bond Copper Aluminum Nitride Aln Ceramic Su
Trademark
OEM
Transport Package
1.Plastic Air Cushion Film 2.Foam Material 3.Car
Specification
As per request
Origin
China
Model NO.
OEM
Feature
High Heat Conductivity
Keyword
Direct Bond Copper Aluminum Nitride Aln Ceramic Su
Trademark
OEM
Transport Package
1.Plastic Air Cushion Film 2.Foam Material 3.Car
Specification
As per request
Origin
China

 

 

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate
 

Product Description

 
Product NameDirect Bond Copper Aluminum Nitride ALN Ceramic Substrate/Dbc Substrate
MaterialAlumina/Aluminum nitride
MetalCopper
Size112*112*3mm
PaymentT/T,Western Union,Online payment by credit card are available
Applicationit is widely used in High-power electronic coDbc/Dpc Direct Bond Copper Aluminum Oxide AL2O3 Metallized Ceramic Substrate mponents.
ThransportAir transport: 5-10 days; Ocean shipping: About one month.
Delivery Time1.stock:delivery within 3-5 days after receiving your payment.

2. OEM/ODM:The normal Lead time is 15-45 days, which depends on your quantiy.

Detailed Photos

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate

Direct Bond Copper Aluminum Oxide AL2O3 Metallized Ceramic Substrate



Our company is specialized in high-power ceramic heat dissipation substrates such as aluminum nitride and aluminum oxide,
with thermal conductivity of 20-240w /M.K. Coating types: gold, platinum, silver, nickel, zinc, color titanium, etc.
The most densely covered line 0.5mil, minimum through hole 2mil, the thinnest coating 2nm, the thickest gold layer 500um,
processing ceramic heat sink, ceramic gold plated substrate, ceramic heat sink processing, gold plated carrier,
heat dissipation substrate, heat conduction pad block.

 

 
Metallization types:





Ceramic insulator + Ag plating
Ceramic insulator + Mn-Mo plating + Ni plating
Ceramic insulator + Mo-Mn plating + Au plating

Ceramic insulator + Mo-Mn plating + Sn plating

Special types are available according to customer's drawings or samples
Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate
Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate
Aluminium nitride Ceramic is commonly used for production of electric circuit ceramic substrates, it is most frequently used ceramic
substrates becasue of its excellent advantages:



- High thermal conductivity
- Low coefficient of expansion
- High strength
- High temperature resistance
- Chemical resistance

- High resistivity
- Small dielectric constant
- No toxicity
 


 
 

 

Certifications

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate
Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc SubstrateDirect Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate

Company Profile

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate
Lianyungang Highborn Technology CO.,LTD



Is a leading high-tech ceramic development and production enterprises.
Our ceramic products are widely used in various fields of automotive, metallurgy, machinery, electronic & electrical, food, chemical, medical and so on. With experienced engineers and talented workers, we are able to evaluate projects and drawings properly, make valuable suggestion, supply satisfying products. Our materials including:
- Alumina ceramic tube, alumina parts( 95% 96% 99% 99.5% 99.7% Al2O3 )
- Zirconia cermaic ( Yttria stabilized ZrO2 )
- Silicon Nitride ( GPS Gas pressure sintered & Hot pressed Si3N4 )
- Silicon carbide
- Boron Carbide ( B4C )
- Boron Nitride ( Hot pressed BN )
- Machinable Glass Ceramic
- Steatite, cordierite

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate

Packaging & Shipping

Direct Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc SubstrateDirect Bond Copper Aluminum Nitride Aln Ceramic Substrate/Dbc Substrate

 

FAQ

Q:Are you a trading company or a manufacturer?

A:We are professional manufacturer which has almost 10 years of experience in this industry.


Q:Can you produce according to the samples?

A:Yes,we can produce by your samples or technical drawings.


Q:Would it be possible for us to visit your factory?

A:Sure,we welcomed our customers visit our factory in any time.


Q:Will your company supply samples?

A:Yes,the sample expense will be deducted from the value of your order.


Q:What's your payment terms?

A:T/T, L/C, Western Union, Money Gram, are available for us.


Q:Delivery time for my order?

A:Within 7-15 working days for your sample order; 20 working days for your bulk order( It depends on the models and quantity you are going to order)