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Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

China Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework, Find details about China Kovar Strip, 4j29 Strip from Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

Model NO.
4J29
Thickness
0.1-2mm
Width
5-280mm
MOQ
30 Kgs
Trademark
TANKII-429
Transport Package
Coil, Waterproof Paper, Wooden Case
Origin
China
HS Code
722699900
Model NO.
4J29
Thickness
0.1-2mm
Width
5-280mm
MOQ
30 Kgs
Trademark
TANKII-429
Transport Package
Coil, Waterproof Paper, Wooden Case
Origin
China
HS Code
722699900
Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

Grade : Kovar nickel-cobalt ferrous alloy/ 29HK/ 4J29
 
Classification : the alloy of expansion characteristics

Application: Kovar (trademark of CRS Holdings, inc., Delaware[1]) is a nickel-cobalt ferrous alloy compositionally identical to Fernico 1, designed to be compatible with the thermal expansion characteristics of borosilicate glass (~5 × 10?6 /K between 30 and 200 °C, to ~10 × 10?6 /K at 800 °C) in order to allow direct mechanical connections over a range of temperatures. It finds application in electroplated conductors entering glass envelopes of electronic parts such as vacuum tubes (valves), X-ray and microwave tubes and some lightbulbs.
 
Chemical Composition in %  Kovar

 Ni
28,5-29,5%
Fe
51,14-54,5%
C
0.03%
Si
0.3%
Mn
0,4 %
S
o 0.015%

P
0.015%
o
17-18%
Ti
0.1%
Al
0.2%
Cu
0.2%
Cr
0,1 %
 
The thermal properties of alloy
 
Temperature coefficient of linear expansion αsr ? 10-6 K-1 in the temperature range, ° Cinflection point temperature, ° C
No less		Heat treatment regime blanks and samples
20-8020-10020-30020-40020-45020-50020-800
--4,6-5,64,6-5,2-5,9-6,4-420samples and blanks annealing in hydrogen, a vacuum or protective atmosphere at a temperature (960 ± 20) ° C, holding 1 hr., cooling with the furnace or container to 200 ° C at a rate not exceeding 10 ° C / min
 
PropertysinteredHIPed 
Density / g cm38.08.35 
Hardness / HV1160150 
Youngs Modulus / GPa138138 
reduction of area at fracture / %3030 
yield strength / MPa270270 
thermal conductivity / W/Km17 
Curie Temperature / °C435 
electrical resistivity Ω mm2 / m0.49 
specific heat J/gK0.46 
thermal expansion coefficient/10?6 K?1 (25 - 200 °C)5.5 
(25-300 °C)5.1 
(25-400 °C)4.9 
(25-450 °C)5.3 
(25-500 °C)6.2 

Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework
Bright Kovar 4j29 Strip 0.4mm*200mm for Stamping IC Framework

 

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