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4j29 Strip Be Used in Etching Electronic Components Match Same Coefficient of Expansion

China 4j29 Strip Be Used in Etching Electronic Components Match Same Coefficient of Expansion, Find details about China Kovar Strip, 4j29 Strip from 4j29 Strip Be Used in Etching Electronic Components Match Same Coefficient of Expansion

Density (g/cm3)
8.2
Temperature Factor of Resistivity
3.7~3.9
Surface
Bright
Condition
Annealing
Alloy
Expansion Alloy
Trademark
Ohmalloy
Transport Package
Coils+ Wooden Case
Specification
2mm
Origin
China
HS Code
7226999001
Density (g/cm3)
8.2
Temperature Factor of Resistivity
3.7~3.9
Surface
Bright
Condition
Annealing
Alloy
Expansion Alloy
Trademark
Ohmalloy
Transport Package
Coils+ Wooden Case
Specification
2mm
Origin
China
HS Code
7226999001
OhmAlloy-4J29  (Expansion alloy)

(Common Name: Kovar, Nilo K, KV-1, Dilver Po, Vacon 12)
OhmAlloy-4J29 also known as Kovar alloy. it was invented to meet the need for a reliable glass-to-metal seal, which is required in electronic devices such as light bulbs, vacuum tubes, cathode ray tubes, and in vacuum systems in chemistry and other scientific research. Most metals cannot seal to glass because their coefficient of thermal expansion is not the same as glass, so as the joint cools after fabrication the stresses due to the differential expansion rates of the glass and metal cause the joint to crack.

Kovar  is a nickel-cobalt ferrous alloy compositionally identical to Fernico, designed to be compatible with the thermal expansion characteristics of borosilicate glass (~5 × 10−6 /K between 30 and 200 °C, to ~10 × 10−6 /K at 800 °C) in order to allow direct mechanical connections over a range of temperatures. It finds application in electroplated conductors entering glass envelopes of electronic parts such as vacuum tubes (valves), X-ray and microwave tubes and some lightbulbs. 
The name Kovar is often used as a general term for Fe-Ni alloys with these particular thermal expansion properties. Note the related particular Fe-Ni alloy Invar which exhibits minimum thermal expansion.

OhmAlloy-4J29was invented to meet the need for a reliable glass-to-metal seal, which is required in electronic devices such as light bulbs, vacuum tubes, cathode ray tubes, and in vacuum systems in chemistry and other scientific research. Most metals cannot seal to glass because their coefficient of thermal expansion is not the same as glass, so as the joint cools after fabrication the stresses due to the differential expansion rates of the glass and metal cause the joint to crack.

OhmAlloy-4J29 not only has thermal expansion similar to glass, but its nonlinear thermal expansion curve can often be made to match a glass, thus allowing the joint to tolerate a wide temperature range. Chemically, it bonds to glass via the intermediate oxide layer of nickel oxide and cobalt oxide; the proportion of iron oxide is low due to its reduction with cobalt. The bond strength is highly dependent on the oxide layer thickness and character. The presence of cobalt makes the oxide layer easier to melt and dissolve in the molten glass. A grey, grey-blue or grey-brown color indicates a good seal. A metallic color indicates lack of oxide, while black color indicates overly oxidized metal, in both cases leading to a weak joint.

Mainly used in electric vacuum components and emission control, shock tube, igniting tube, glass magnetron, transistors, seal plug, relay, integrated circuits lead, chassis, brackets and other housing sealing.

 

Normal composition%

Ni28.5~29.5FeBal.Co16.8~17.8Si≤0.3
Mo≤0.2Cu≤0.2Cr≤0.2Mn≤0.5
C≤0.03P≤0.02S≤0.02  
 

Tensile Strength, MPa

Code of conditionConditionWireStrip
RSoft≤585≤570
1/4I1/4 Hard585~725520~630
1/2I1/2 Hard655~795590~700
3/4I3/4 Hard725~860600~770
IHard≥850≥700
 

Typical Physical properties

Density (g/cm3)8.2
Electrical resistivity at 20ºC(Om*mm2/m)0.48
Temperature factor of resistivity(20ºC~100ºC)X10-5/ºC 3.7~3.9
Curie point   Tc/ ºC430
Elastic Modulus,  E/ Gpa138







Coefficient of expansion
θ/ºCα1/10-6ºC-1θ/ºCα1/10-6ºC-1
20~607.820~5006.2
20~1006.420~5507.1
20~2005.920~6007.8
20~3005.320~7009.2
20~4005.120~80010.2
20~4505.320~90011.4



Thermal conductivity
θ/ºC100200300400500
λ/ W/(m*ºC)20.621.522.723.725.4
 
The heat treatment process
Annealing for stress reliefHeated to 470~540ºC and hold 1~2 h. Cold down
annealingIn vacuum heated to 750~900ºC
Holding time  14 min~1h.
Cooling rateNo more than  10 ºC/min cooled to 200 ºC

Style of supply
Alloys NameTypeDimension 
OhmAlloy-4J29WireD= 0.1~8mm 
OhmAlloy-4J29StripW= 5~250mmT= 0.1mm
OhmAlloy-4J29FoilW= 10~100mmT= 0.01~0.1
OhmAlloy-4J29BarDia= 8~100mmL= 50~1000
 

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