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Multi-Layer Polyimide FPC Rigid-Flex PCB Factory with Enig

China Multi-Layer Polyimide FPC Rigid-Flex PCB Factory with Enig, Find details about China FPC, Circuit Board from Multi-Layer Polyimide FPC Rigid-Flex PCB Factory with Enig

Model NO.
GAPCB623
Structure
Multilayer Rigid PCB
Dielectric
FR-4
Material
Epoxide Woven Glass Fabric Laminate
Application
Communication
Flame Retardant Properties
V0
Processing Technology
Delay Pressure Foil
Production Process
Subtractive Process
Base Material
Polyimide, Fr4, Fr1, Cem3, Ce
Insulation Materials
Epoxy Resin
Copper Thickness
1oz
Board Thickness
0.11mm-0.5mm, 0.2mm/0.4mm
Min. Hole Size
0.2mm/0.3mm
Min. Lin Width
0.075mm/0.075mm(3mil/3mil)
Min. Line Spacing
0.10mm, 0.1mm4mil
Surface Finishing
Immersion Gold, HASL, Enig
Solder Mask Color
Green, Black, Red, White
Max.Board Length
800mm
Certificates
ISO/UL/Ts16949/RoHS
Service
Customized
Trademark
Good ahead
Transport Package
Carton/Vacuum/Bubble Bags/According
Specification
Customizable
Origin
China(Mainland)
HS Code
8534009000

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