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BGA Technology Immersion Gold PCB

China BGA Technology Immersion Gold PCB, Find details about China Pcb, Pcb Circuit from BGA Technology Immersion Gold PCB

Dielectric
FR-4
Layer
1~20 Layers
Base Material
Fr1, Fr4, Cem-3, Aluminium, Ceramic
Copper Thickness
0.5~3.2mm
Surface Finishing
HASL,Lead Free HASL,OSP,Enig...
Board Thickness
0.5~3.2mm
Min. Line Spacing
0.08mm
Ring Annulus
Min 0.1mm
Layer to Layer Rrgistration
+/-0.003"
Hole Position Accuracy
+/-0.003"
Aspect Ratio
Min 1:8
Trademark
MJ
Specification
UL, SGS, RoHs, TS
Origin
Dalian, Liaoning
HS Code
8534009000

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