High Precision Cutting Machine for Semiconductor Wafer

China High Precision Cutting Machine for Semiconductor Wafer, Find details about China Laser Scribing, Fiber Laser Scriber from High Precision Cutting Machine for Semiconductor Wafer

Model NO.
SFM20/SFM30/SFM50
Production Scope
Parts Production Line
Laser
Fiber Laser
Footprint
1175*845*1485mm
Work Table
T-Model Ball Screw Transmission
Consumption Parts
No Need
Max Working Hours
24 Hrs/7days
Power Consumption
1kVA
Max Scribing Speed
200mm/S
Fiber Laser Power
20W
Application
Industrial
Motor
Servo Motor
Cooling System
Air Cooling
Standard Module Design
Standard Module Design
Applicable Fields
Poly-Crystalline Silicon;Mono-Crystallion Silicon
Solar Cell
Solar Wafer
Industries
Solar Industries
Trademark
ARGUS
Transport Package
Export Standard Wooden Case
Specification
210*210mm or 350*350mm
Origin
China
HS Code
8486402900
Model NO.
SFM20/SFM30/SFM50
Production Scope
Parts Production Line
Laser
Fiber Laser
Footprint
1175*845*1485mm
Work Table
T-Model Ball Screw Transmission
Consumption Parts
No Need
Max Working Hours
24 Hrs/7days
Power Consumption
1kVA
Max Scribing Speed
200mm/S
Fiber Laser Power
20W
Application
Industrial
Motor
Servo Motor
Cooling System
Air Cooling
Standard Module Design
Standard Module Design
Applicable Fields
Poly-Crystalline Silicon;Mono-Crystallion Silicon
Solar Cell
Solar Wafer
Industries
Solar Industries
Trademark
ARGUS
Transport Package
Export Standard Wooden Case
Specification
210*210mm or 350*350mm
Origin
China
HS Code
8486402900

High Precision Cutting Machine for Semiconductor Wafer

 High Precision Cutting Machine for Semiconductor Wafer

High Precision Cutting Machine for Semiconductor Wafer
It is suitable for the slicing of single crystal silicon, polysilicon, amorphous silicon solar cell (cell) and silicon wafer (wafer).
Company & Workshop 
High Precision Cutting Machine for Semiconductor WaferHigh Precision Cutting Machine for Semiconductor Wafer

High Precision Cutting Machine for Semiconductor Wafer

Wuhan Sunic Photoelectricity Equipment Manufacture Co.,Ltd (Sunic Laser) has been dedicated to the manufacturing of Laser equipments since 1998. We are specialized in designing, manufacturing as well as providing services for Laser processing machines and whole equipments for Solar PV production line. We offer complete solutions with Laser application for customers all over the world. Sunic Laser would like to be customer's technical consultant and support in Laser and solar equipments to make further development and progress together.

Customer visit
High Precision Cutting Machine for Semiconductor Wafer
Exhibition
High Precision Cutting Machine for Semiconductor Wafer
High Precision Cutting Machine for Semiconductor Wafer
High Precision Cutting Machine for Semiconductor Wafer
High Precision Cutting Machine for Semiconductor Wafer
Certification
High Precision Cutting Machine for Semiconductor Wafer



Why choose Argus's solutions
 

 1. 16 Years Of Experience In Module Mfg & EPC
 2. In House R&D And Module Mfg Facilities
 3. Complete Business Project Report Provided
 4.Detailed Design & Line Layout  For Factory
 5.Manpower Recruitment & Selection Support
 6.Complete Process & Service Support  
 7.Training Both In House & Onsite By Experts 

Packing & Delivery
Packaging  Materials: Metal Strip&Wood Crate
Port
Shanghai
Lead Time :
Within 7-15 Woking Days after payment

Please feel free to contact us if you have any inquiries or questions.
Wuhan Sunic Photoelectricity Equipment Manufacture Co., Ltd.
Web:http://whsunic.en.made-in-china.com
Add: 4#, Huanglong Shan North Road, East Lake High-Tech District,
Wuhan, P.R. China. P.C.430070