China Tb20110 Thermostatic Bimetal Strip for Micro Circuit Breaker, Find details about China P675r, Thermal Bimetal Alloy from Tb20110 Thermostatic Bimetal Strip for Micro Circuit Breaker
Bimetal Strip Telcon 200 for Coffee heater switch
Telcon 200 (Bimetallic strip)
(Common Name: 108SP / Telcon 200 / P675R / 5J11 / Chace 7500 Thermostatic Bimetal Strip)
The sideways displacement of the strip is much larger than the small lengthways expansion in either of the two metals. This effect is used in a range of mechanical and electrical devices. In some applications the bimetal strip is used in the flat form. In others, it is wrapped into a coil for compactness. The greater length of the coiled version gives improved sensitivity.
Chemical composition(%)
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Ni36 | ≤0.05 | ≤0.3 | ≤0.6 | ≤0.02 | ≤0.02 | 35~37 | - | - | Bal. |
Grade | C | Si | Mn | P | S | Ni | Cr | Cu | Fe |
Mn75Ni15Cu10 | ≤0.05 | ≤0.5 | Bal. | ≤0.02 | ≤0.02 | 14~16 | - | 9~11 | ≤0.8 |
Composition
Grade | Telcon 200 |
High expansion layer | Mn75Ni15Cu10 |
Low expansion layer | Ni36 |
Typical Physical properties
Density (g/cm3) | 7.7 |
Electrical resistivity at 20ºC(OMmm2/m) | 1.13 ±5% |
Thermal conductivity, λ/ W/(m*ºC) | 6 |
Elastic Modulus, E/ Gpa | 113~142 |
Bending K / 10-6 ºC-1(20~135ºC) | 20.8 |
Temperature bending rate F/(20~130ºC)10-6ºC-1 | 39.0%±5% |
Allowable temperature (ºC) | -70~ 200 |
Linear temperature (ºC) | -20~ 150 |
Application: The material is mainly in automatic control devices and instrumentation (eg: exhaust thermometers, thermostats, voltage regulators, temperature relay, automatic protection switching, diaphragm meters, etc.) make temperature control, temperature compensation, current limit, temperature indicator and other heat-sensitive components.
Feature: The basic characteristics of Thermostat Bimetallic is bending deformation with temperature changes, resulting in a certain moment.
Thermostat Bimetallic Strip expansion coefficient is different from the two or more layers of metal or alloy along the entire contact surface firmly bonded, having a temperature-dependent shape change occurs thermosensitive functional composites. Wherein the higher expansion coefficient of the active layer is a layer called a low coefficient of expansion of the layer is named passive layer.