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to- 46 /to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier

China to-46/to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier, Find details about China to-46, to-56 from to-46/to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier

Model NO.
Electronic Packages
Shape
Customizable
Interface Type
Customizable
Certification
BS, UL, VDE
Brand
Huona
OEM
Yes
Sample
Free
Surface
Bright
Sealing Materials
Kovar/Tungsten-Copper Alloy
MOQ
5000-10000PCS
Trademark
HUONA
Transport Package
Case
Specification
customizable
Origin
Shanghai
HS Code
85177090
Model NO.
Electronic Packages
Shape
Customizable
Interface Type
Customizable
Certification
BS, UL, VDE
Brand
Huona
OEM
Yes
Sample
Free
Surface
Bright
Sealing Materials
Kovar/Tungsten-Copper Alloy
MOQ
5000-10000PCS
Trademark
HUONA
Transport Package
Case
Specification
customizable
Origin
Shanghai
HS Code
85177090
To-46/To-56/ To-18/To-39/F11/To-5/To -type Fiber optic package for Photoamplifier
 
▪    Flatpack
▪    Plug-Ins Metal Package
 
We have an extensive range of Hermetic Opto-electronic packages.
 
High reliability, hermeticall sealed product in many configurations including standards--Flatpacks(butterfly style), Plug-ins(bathtub style), and plat-forms(dual-in-line style), and many other sophisticated metal composite packages. These packages are developed to hermetically encapsulate laser diode transmitter and receiver assemblies and other Opto-electronic circuits.
 
Products can be manufactured with matched glass-to metal seals or stripline ceramic inserts, utilizing materials ranging from ASTM F-15 to advanced thermal management materials to enhance and optimize device performance.
 
High quality products are made in conformance with and certified being compliant to MIL-PRF-38534.

Typical Opto Material Combinations
 
Base MaterialBase Conductivity W/m ~KCTE X 10-6/~CDensity LBS/in 3Ring Frame Material
ASTM F-15144.9.302ASTM F-15
W/Cu175 - 2056.5 - 8.3.535 - .611Fe Ni Alloy
Mo/Cu165 - 1856.5 - 7.7.357 - .361Fe Ni Alloy
Mo1406.0.408ASTM F-15
Al/SiC1606.5 - 8.5.107 - .110Contact the factory

Huona has a depth of product range, from commercial and mil spec connectors and headers to microelectronic hermetic packages, TO's and battery seals, tantalum capacitors seals, and end seals.
 
we have the technology focus on doing what we do best: glass to metal and ceramic to metal sealing.
 
Manufactured bodies we using are standard materials - Cold Rolled Steel, Stainless Steel, Kovar…and exotic…Inconel, Monel, Molybdenum, and Titanium
Electrodes in 52 Alloy, Kovar, Stainless Steel, and Inconel; also Chromel/Alumel and Iron/Constantin for thermocouple applications

UNITARY HERMETIC INSULATING CROSSROADS

Technologies: Glass-Metal Sealing, Glass-Metal Sealing by Compression, Glass-Titanium Sealing and Ceramic-Metal Brazing

Materials (non-exhaustive list): Dilver P1 (Kovar), Iron Alloys Nickel, Stainless Steel, Titanium, Ceramic, Steel, Inconel, Copper

Fields of application: all the equipment to be protected in a hermetic enclosure: transformers, capacitors, relays, rectifiers, etc.

By way of example, hermetic insulating bushings in stainless steel or steel are used for environments subjected to pressure.

Specialist Hermetic Sealing Glass-Metal Brazing and for the medical, aerospace, nuclear, research
oil, military and industrial, Huona (Shanghai) New Material has developed in recent years by proposing assemblies Glass-Titanium and Ceramic-Metal.
Huona continues its policy of diversification and innovation in assembly and interconnection solutions, all of which these new products have enabled Huona to increase by 50% its turnover in the last two years (5M Euros including 20% export)
Product ranges offered Glass-Metal Classic Technology:
unit vias (Ø 0.7 mm to several mm), multipass (+ 1000), Tin plate shape, bowl, dish, fbre optical connectors,pigs, microwave beads etc ...
Used materials:
Steel, stainless steel, DP1 (KOVAR), Titanium (T40, TA6V), molybdenum, Monel, Hastelloy B3, iron-nickel alloy, Inconel X750, steel MP35N, SB26 (Copper-Nickel-Silicon alloy), Platinum.
New technologies & new products:
- Brazing Metal-Ceramic (ceramic metallization by sputtering or thick layer), or Titanium Sapphire Brazing Quartz Titanium. [Ag / Cu used solder; Ag / Cu / Pd; Ag; Au / Cu; Au; Cu (780ºCto 1083 ºC).]
- Au / Sn Saphir-Kovar brazing.
- Glass-Titanium sealing (non-magnetic assembly).
We are designer and we meet your specific needs according to your specifications charges  .

Specialist in Glass to Metal Hermetic Sealing, and Brazing for different applications such as medical, space, nuclear, oil exploration, military and industry, Huona has grown these past years by providing glass to titanium and ceramic to metal assemblies.
These new solutions allow Huona to increase the turnover of around 50% for the last two years. (€ 5M including 20% export).
Glass sealing classic products:
Single lead (diameter: from 0.7mm to several millimeters.), Multi lead (more than 1000 pins), flat-form package, plug-in package, fat pack, optical package, connectors, connectors, microwave bead, etc ...
Raw material:
Steel, Stainless Steel, Kovar, Titanium, Molybdenum, Hastelloy B3, Copper-Nickel Alloy, Inconel, Iron-Nickel Alloy, Platinum.
New technologies & new products:
- Ceramic to Metal seal (metallization ceramic by sputtering or thin layer), sapphire or quartz metal seal. [Brazed used Ag / Cu; Ag / Cu / Pd; Ag; Au / Cu; Au; Cu (780ºC to 1083ºC).]
- Gold tin brazed Kovar-Sapphire.
- Glass to Titanium Seal.
Our R & D department design your product following your own specifcations
to-46/to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier
to-46/to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier
to-46/to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier
to-46/to-56/ to-18/to-39/F11/to-5/to -Type Fiber Optic Package for Photoamplifier

 

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