FPC for Wearable Devices, Personal Health Devices, Finger-Print Recognition Devices

China FPC for Wearable Devices, Personal Health Devices, Finger-Print Recognition Devices, Find details about China Flexible PCB, FPC from FPC for Wearable Devices, Personal Health Devices, Finger-Print Recognition Devices

Basic Info.

Model NO.

P7106

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Metal Composite Materials

Brand

Suntek

Documents Needed

Gerber File, Bom

Trademark

SUNTEK

Transport Package

CTN with ESD Bag

Specification

18*10cm

Origin

China

HS Code

8537109090

Model NO.

P7106

Processing Technology

Electrolytic Foil

Base Material

Copper

Insulation Materials

Metal Composite Materials

Brand

Suntek

Documents Needed

Gerber File, Bom

Trademark

SUNTEK

Transport Package

CTN with ESD Bag

Specification

18*10cm

Origin

China

HS Code

8537109090

Product Desciption

Reliable Flex PCB & Rigid-Flex PCB Manufacturer

Suntek Electronics is a professional PCB, Flex PCB & Rigid-Flex PCB Manufacturer.

We do provide one-stop-service, OEM service, while Gerber file is needed.

We would like to submit samples for your testing and willing to give quality guarantee for our Flex PCBs.

Suntek FPC Capacity

Base Material	Polyimide (Kapton) ( PI )
Layers	Flexible Printed Circuit(FPC) Board:1~10layers
Layers	Rigid-Flex Board:2~10layers
Product thickness tolerance	± 0.03mm
Minimum Line Width/ Distance between stitchings	± 0.05mm
Stiffener material type	PI / FR4 / PET / Steel piece
Etching tolerance	± 0.02mm
Minimum Hole Diameter	0.1mm
Hole tolerance	PTH: +/- 0.05mm
Hole tolerance	NPTH: +/-0.03mm
Outline profile	Punching , Laser cut
Outline Dimension tolerance	± 0.1mm
Solder mask color	Yellow,Black,white
Surface treatment	OSP: 0.2-0.5um
	ENIG: Au 0.03um - 0.15um
	Immersion Tin:0.5-1.5um
	Immersion silver: 0.1-1.2um
	Gold plating: Au 1-150U''
Thermal shock test	288 ± 5 ºC , 10S , 3times

Key Specifications/Special Features -- Rigid-Flex PCB:
PCB board layers	Mass production:2-58 layers/Pilot run:64 layers
pcb Max.Thickness	Mass production:394mil(10mm)/Pilot run:17.5mm
pcb Min.Width/Spacing	Inner layer:3mil/3mil(HOZ),Outer layer:4mil/4mil(1OZ)
pcb Max Copper Thickness	UL certificated: 6.0OZ/Pilot run: 12OZ
pcb board Min.Hole Size	Mechanical drill:8mil(0.2mm) Laser drill:3mil(0.075mm)
Pcb Board Size	Min 6mm6mm, Max 400mm500mm

HDI PCB:
HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

High TG PCB:
The general TG plate is more than 130 degrees, the high TG is generally greater than 170 degrees, and the medium TG is more than 150 degrees.

High Frequency PCB:
RO4003C, RO4350B, Ro3003, Ro3010, and RT5880 etc with frequency typically in the range from 500MHz to 2GHz, products are applied to power devider,radar,satellite system, mobile phone reception base station and so on.

Carbon Ink PCB:
As carbon ink pcb has very good resistance value that will help supply good conductivity. Carbon ink pcb is widely used in automotive filed, medical electronics,communication equipment and so on.

Special Material PCB:
Rogers4350,Rogers4003,Arlon 25FR,25N for Ceramic PCB powder filling, Rogers series, Taconic series,Arlon series,Nelco series ect for PTFE high frequency material.

Thick Copper PCB:
Ensure that there is enough thick copper plating in the hole to ensure that the resistance is within the range of the process requirements. 70% of the circuit board to complete the use of 35um of copper foil thickness, some will use 70um , 105um ,140um copper thickness and so on.

Welcome to share your gerber file for us to quote.
Thanks.

FPC for Wearable Devices, Personal Health Devices, Finger-Print Recognition Devices