Quick Turn Prototype PCB 4layer Blue PCB Gold PCB Sample Making
China Quick Turn Prototype PCB 4layer Blue PCB Gold PCB Sample Making, Find details about China PCB, Mother Board from Quick Turn Prototype PCB 4layer Blue PCB Gold PCB Sample Making
Basic Info.
Model NO.
gold pcb
Processing Technology
Electric Gold
Base Material
Fr4 Tg140
Insulation Materials
Organic Resin
Brand
OEM
Board Thickness
3.2mm
Copper
15/6oz
Finish
Electronic Gold 10u"
Mini Hole
0.4mm
Mini Width/Space
10/10mil
Trademark
NO
Transport Package
Vacuum
Specification
85 X 82mm
Origin
Made in China
HS Code
8534009000
Model NO.
gold pcb
Processing Technology
Electric Gold
Base Material
Fr4 Tg140
Insulation Materials
Organic Resin
Brand
OEM
Board Thickness
3.2mm
Copper
15/6oz
Finish
Electronic Gold 10u"
Mini Hole
0.4mm
Mini Width/Space
10/10mil
Trademark
NO
Transport Package
Vacuum
Specification
85 X 82mm
Origin
Made in China
HS Code
8534009000
Product Desciption
Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.
Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%
Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.
Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%
Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%
| Rigid PCB Production Capacity | ||
| SERIAL | ITEM | TECHNICAL DATA |
| 1 | Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI |
| 2 | Layers | 2-32(layers) |
| 3 | Max Board Size | 450x660mm 18" x 26" |
| 4 | Min Board Thickness | 4(layers)0.40mm 16mil |
| 6(layers)0.80mm 32mil | ||
| 8(layers)1.00mm 40mil | ||
| 10(layers)1.20mm 48mil | ||
| 5 | Copper Clad(Max.) | 20 oz(outer)/4 oz(inner) |
| 6 | Min line Width/space | 0.075mm 3mil |
| 7 | Drill Size Mechanical (min) | 0.20mm 8mil |
| 8 | Drill Size Laser(min) | 0.10mm 4mil |
| 9 | PTH Wall Thickness | 0.020mm 0.8mil |
| 10 | PTH dia tolerance | ±0.075mm ±3mil |
| 11 | NPTH hole dia tolerance | ±0.05mm ±2mil |
| 12 | Hole Position Deviation | ±0.05mm ±2mil |
| 13 | Outline Tolerance | ±0.10mm ±4mil |
| 14 | S/M Pitch | 0.08mm 3mil |
| 15 | Insulation Resistance | 1E+12Ω(Normal) |
| 16 | Test Voltage | 50~300V |
| 17 | Aspect ratio | 8:01 |
| 18 | Thermal Shock | 3x10Sec@288 ºC |
| 19 | Warp and Twist | ≤0.7% |
| 20 | Current breakdown | 10A |
| 21 | Electric Strength | >1.3KV/mm |
| 22 | Peel Strength | 1.4N/mm |
| 23 | Solder Mask Abrasion | ≥6H |
| 24 | Flammability | 94V-0 |
| 25 | Impedance Control | +/-10%(Differential) |
| 26 | Buried Via | Yes |
| 27 | Blind Via | Yes |
| 28 | HDI | 2+N+2 4mil Via hole |
| 29 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL free |
| 30 | Materials | FR-4 , Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, black Fr4 |
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