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SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm

China SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm, Find details about China Emcp BGA280 SD Adapter, BGA SD Test Socket from SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm

Model NO.
702-0001587
Character
Environmental Protection
Production Process
CNC
Interface Type
SD Interface
Brand
Sireda
Pin Count
280
Pitch
0.45mm
Contact
Spring Probe
Package
BGA
IC Size
14X14.5mm
IC Chip Type
Without Solder Ball
Structure
Clamshell
Socket Body
PPS/Torlon
Socket Lid
Al
Customized Operation Temperature
-40 ~ 140 ºC
MOQ
No MOQ Limitation
Trademark
Sireda
Transport Package
Carton
Specification
BGA280
Origin
Shenzhen, China
HS Code
8536690000
Model NO.
702-0001587
Character
Environmental Protection
Production Process
CNC
Interface Type
SD Interface
Brand
Sireda
Pin Count
280
Pitch
0.45mm
Contact
Spring Probe
Package
BGA
IC Size
14X14.5mm
IC Chip Type
Without Solder Ball
Structure
Clamshell
Socket Body
PPS/Torlon
Socket Lid
Al
Customized Operation Temperature
-40 ~ 140 ºC
MOQ
No MOQ Limitation
Trademark
Sireda
Transport Package
Carton
Specification
BGA280
Origin
Shenzhen, China
HS Code
8536690000
Product Description
SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm
eMCP BGA280 Test socket
 
1. Applicable for eMMC,eMCP devices from Samsung, Hynix,  Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529. 

2. Support for eMMC version 5.0 or above.

3. Chip-off IC devices failure analysis, real time write-and-read in forensic application.

4. Support for hot plug, eMMC/eMCP can be directly connected to PC with SD port.

 

Product Parameters
Mechanical
Material Socket BodyTorlon/PPS
Material Socket LidAL, POM
ContactPogo Pin
Operation Temperature-0 ~ 80 ºC
Life Span50K Cycles
Spring Force20g ~ 30g per Pin
Electrical
Current Rating2.59A
DC Resistance42mΩ@0.65mm
 
Specification

eMCP BGA280(702-0001587)

IC Size: 14X14.5mm
Solder Ball: without solder ball
SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm


 
SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm
SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm

 
Relative Products

Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.

Part NumberDescriptionIC Chip Type
702-0000857BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0000859BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0000873BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BAWith solder ball
702-0000875BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NBWithout solder ball
702-0000865BGA186 0.5mm eMCP CS125 12x16mm SD B0 BAWith solder ball
702-0000867BGA186 0.5mm eMCP CS125 12x16mm SD B0 NBWithout solder ball
702-0000899BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0001037BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0001028BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BAWith solder ball
702-0001040BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NBWithout solder ball
702-0000976BGA100 1.0mm eMMC CS125 14x18mm SD B0 BAWith solder ball
702-0001035BGA100 1.0mm eMMC CS125 14x18mm SD B0 NBWithout solder ball
702-0001315BGA136 0.5mm eMMC CS125 10x10mm SD  B0 NBWithout solder ball
702-0001326BGA136 0.5mm eMMC CS125 10x10mm SD B0 BAWith solder ball
702-0000828BGA529 0.5mm eMCP CS125 15x15mm SD B0 BAWith solder ball
702-0000830BGA529 0.5mm eMCP CS125 15x15mm SD B0 NBWithout solder ball
702-0001586BGA254 0.5mm eMCP CS125 12x15mm SD B0 NBWithout solder ball
702-0001587BGA280 0.45mm eMCP CS125 14x14.5mm SD B0 NBWithout solder ball
702-0001685BGA153+162+221 0.5mm CS125 3 in1 SD B0 NBWithout solder ball


 
Company Profile

SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mmSireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.


Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm

Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
 
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

SD Kit Interface BGA280 Emcp Socket Without Solder Ball 14X14.5mm


 

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