China Emcp BGA162 SD Test Socket Clamshell 11.5X13mm with Solder Ball, Find details about China Emcp BGA162 SD Adapter, BGA SD Test Socket from Emcp BGA162 SD Test Socket Clamshell 11.5X13mm with Solder Ball
Mechanical | |
Material Socket Body | Torlon/PPS |
Material Socket Lid | AL, POM |
Contact | Pogo Pin |
Operation Temperature | -0 ~ 80 ºC |
Life Span | 50K Cycles |
Spring Force | 20g ~ 30g per Pin |
Electrical | |
Current Rating | 2.59A |
DC Resistance | 42mΩ@0.65mm |
Part Number | Description | IC Chip Type |
702-0000857 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0000859 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000873 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BA | With solder ball |
702-0000875 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NB | Without solder ball |
702-0000865 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 BA | With solder ball |
702-0000867 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 NB | Without solder ball |
No MOQ | No MOQ limitation here. Our cooperation can begin with the sample and provide quality assurance to you before mass production. |
High Cost Performance | We provide products with high quality and competitive price. |
Technical Support | We have a professional R & D team and all the engineers have more than 5 years' experience. So we have the ability to design and produce best products according to our customers' requirements. |
Best Service | We provide inquiry and consulting & technical support for both pre-sale and after sale. Strictly quality control is in each production process. Our team are keep helping our customers to solve their problems anytime if needed. |
![]() | Shenzhen Sireda Technology Co., Ltd. |
Add | Area A,Floor 6, Building 4, the 10th Industry Park, GuangMing District,Shenzhen 518132 |
We provide products with good quality and fast response, also provide customized service. If you like to learn more about us, please have a look at our website: siredatech.en.made-in-china.com. |