Low Expansion Borosilicate Glass 3.3 for 3D Printer

China Low Expansion Borosilicate Glass 3.3 for 3D Printer, Find details about China Borosilicate Glass, 3d Printer Glass from Low Expansion Borosilicate Glass 3.3 for 3D Printer

Model NO.
blp-bg-001
Expansion Coefficient
3.25
Trademark
Bolipai
Specification
ISO9001, CCC
Origin
Guangdong China
Model NO.
blp-bg-001
Expansion Coefficient
3.25
Trademark
Bolipai
Specification
ISO9001, CCC
Origin
Guangdong China
3D Printer Borosilicate Glass Plate 214 x 200 x 3.3 mm (8.4 x 8 x. 13)

Low-expansion Borosilicate (LEGB) Windows are very useful as windows in many harsh applications because borosilicate glass has excellent chemical and thermal-shock resistance and has a maximum working temperature of 500° C so are excellent for use in high powered light source applications or an excellent choice for cold and hot mirror substrates.


Borosilicate windows can also be a good substrate for optical flats as it has low expansion properties and therefore maintains its flatness in different environmental conditions.
High temperature load capacity:
- up to 550° C permanent load
- up to 600° C temporarily (< 10h)
Low thermal coefficient of expansion
Thermal coefficient matches silicon
(anodic bonding)
High thermal shock resistance
Clear, practically colorless appearance
Low fluorescence
High UV-Transmission
High chemical resistance against acids,
Bases and organic substances
Low alkali content in the glass composition
Low specific weight


BOROSILICATE FLOAT GLASS 3.3 application
Substrates for dielectric coatings
Lighting applications
Optical filter coating substrates
Wafer substrates
Anodic bonding applications
Biotechnology
Photovoltaics
Environmental technology
Harsh environments
Neutron absorbers
Measurement and sensor technology


Any enquires, please feel free to contact me; )
Mobile: 86-15875046064(Jack Liang)
Mechanical   properties  
Density (g/cm3) (at 25°C) 2.23±0.02
Knoop hardness 480
Flexure   strength 24Mpa
Thermodynamic   properties  
Coefficient   of   thermal   expansion (α) (0-300°C) 3.3±0.1×10-6
Softening point (°C) 830±10
Strain   point  (°C) 521±10
Specific   heat   capacity (2-100°C)0.83KJ×(kg×K)-1
Thermal conductivity 1.2W×(m×k)-1
Thermal shock resistance(K) 300
Temperature performance(K) 200
Maximum   working   temperature (>10h, 600°C), (>10h, 550°C)
Chemical properties  
Water   resistence ISO719/DIN12111, HGB1
ISO720, HGA1
Acid   resistance ISO1776/DIN12116, 1
Alkali   resistance ISO695/DIN52322, A2
Optical   properties  
Refractive   index Nd: 1.47379
Transmittance (5mm) >92%
Electrical   properties  
Specific   resistance  1g 250°C, 8.0Ω×cm
Dielectric loss Tan , 38×(10)-4
Dielectric Constant 4.7
Chemical   component  
SiO2 79-82%
B2O3 8-14%
Na2O 2-4%
Al2O3 1-6%