China Industrial Multimode SFP Module, Find details about China SFP, SFP Transceiver from Industrial Multimode SFP Module
Product Features |
Applications |
General |
I. Pin Descriptions | ||||
Pin | Symbol | Name/Description | Ref. | |
1 | VeeT | Transmitter Ground (Common with Receiver Ground) | 1 | |
2 | TX Fault | Transmitter Fault. | ||
3 | TX Disable | Transmitter Disable. Laser output disabled on high or open. | 2 | |
4 | MOD_DEF(2) | Module Definition 2. Data line for Serial ID. | 3 | |
5 | MOD_DEF(1) | Module Definition 1. Clock line for Serial ID. | 3 | |
6 | MOD_DEF(0) | Module Definition 0. Grounded within the module. | 3 | |
7 | Rate Select | No connection required | ||
8 | LOS | Loss of Signal indication. Logic 0 indicates normal operation. | 4 | |
9 | VeeR | Receiver Ground (Common with Transmitter Ground) | 1 | |
10 | VeeR | Receiver Ground (Common with Transmitter Ground) | 1 | |
11 | VeeR | Receiver Ground (Common with Transmitter Ground) | 1 | |
12 | RD- | Receiver Inverted DATA out. AC Coupled | ||
13 | RD+ | Receiver Non-inverted DATA out. AC Coupled | ||
14 | VeeR | Receiver Ground (Common with Transmitter Ground) | 1 | |
15 | VccR | Receiver Power Supply | ||
16 | VccT | Transmitter Power Supply | ||
17 | VeeT | Transmitter Ground (Common with Receiver Ground) | 1 | |
18 | TD+ | Transmitter Non-Inverted DATA in. AC Coupled. | ||
19 | TD- | Transmitter Inverted DATA in. AC Coupled. | ||
20 | VeeT | Transmitter Ground (Common with Receiver Ground) | 1 | |
II. Absolute Maximum Ratings | |||||||
Parameter | Symbol | Min | Typ | Max | Unit | Ref. | |
Maximum Supply Voltage | Vcc | -0.5 | +4.0 | V | |||
Storage Temperature | TS | -40 | +100 | °C | |||
Case Operating Temperature | TOP | 0 | +70 | °C | |||
Relative Humidity | RH | 0 | 85 | % | 1 | ||
III. Electrical Characteristics (TOP=25°C, Vcc=3.3Volts) | |||||||
Parameter | Symbol | Min | Typ | Max | Unit | Ref. | |
Supply Voltage | Vcc | 3.00 | 3.60 | V | |||
Supply Current | Icc | 180 | 300 | mA | |||
Transmitter | |||||||
Input differential impedance | Rin | 100 | Ω | 2 | |||
Single ended data input swing | Vin, pp | 250 | 1200 | mV | |||
Transmit Disable Voltage | VD | Vcc - 1.3 | Vcc | V | |||
Transmit Enable Voltage | VEN | Vee | Vee+ 0.8 | V | |||
Transmit Disable Assert Time | 10 | us | |||||
Receiver | |||||||
Single ended data output swing | Vout, pp | 250 | 800 | mV | 3 | ||
Data output rise time | tr | 175 | ps | 4 | |||
Data output fall time | tf | 175 | ps | 4 | |||
LOS Fault | VLOS fault | Vcc - 0.5 | VccHOST | V | 5 | ||
LOS Normal | VLOS norm | Vee | Vee+0.5 | V | 5 | ||
Deterministic Jitter Contribution | RXΔDJ | 80 | ps | 6 | |||
Total Jitter Contribution | RXΔTJ | 122.4 | ps | ||||
IV. Optical Characteristics (TOP=25°C, Vcc=3.3 Volts) | |||||||
Parameter | Symbol | Min | Typ | Max | Unit | Ref. | |
Transmitter | |||||||
Output Opt. Power | PO | -9 | - | -3 | dBm | 1 | |
Optical Wavelength | λ | 830 | 850 | 860 | nm | ||
Spectral Width | σ | - | - | 0.85 | nm | ||
Side Mode Suppression Ratio | SMSR | 30 | - | - | dB | ||
Optical Rise/Fall Time | tr/tf | - | - | 175 | ps | 2 | |
Deterministic Jitter Contribution | TXΔDJ | - | - | 0.07 | UI | 3 | |
Total Jitter Contribution | TXΔTJ | - | - | 0.007 | UI | ||
Optical Extinction Ratio | ER | 9 | 10 | - | dB | ||
Receiver | |||||||
Average Rx Sensitivity | RSENS | - | - | -20 | dBm | 4 | |
Maximum Received Power | RXMAX | -2 | - | - | dBm | ||
Optical Center Wavelength | λC | 770 | 850 | 860 | nm | ||
LOS De-Assert | LOSD | - | - | -24 | dBm | ||
LOS Assert | LOSA | -35 | - | - | dBm | ||
LOS Hysteresis | 0.5 | - | - | dB | |||
V. General Specifications | |||||||
Parameter | Symbol | Min | Typ | Max | Units | Ref. | |
Data Rate | BR | - | - | 1250 | Mb/sec | 1 | |
Bit Error Rate | BER | - | - | 10-12 | 2 | ||
Max. Supported Link Length on 50/125μm MMF @ 1.25G | LMAX | - | - | 550 | m | 3 | |
VI. Environmental Specifications |
Parameter | Symbol | Min | Typ | Max | Units |
Case Operating Temperature | Top | -40 | +85 | °C | |
Storage Temperature | Tsto | -40 | +100 | °C |
VII. Mechanical Specifications |
IX. PCB Layout and Bezel Recommendations |