High Thermal Conductivity Aln Aluminum Nitride Ceramics Heat Sink and Plate

China High Thermal Conductivity Aln Aluminum Nitride Ceramics Heat Sink and Plate, Find details about China Ceramic Heat Sink, Aluminum Nitride from High Thermal Conductivity Aln Aluminum Nitride Ceramics Heat Sink and Plate

Basic Info.

Origin

China

Origin

China

Product Desciption

Aluminum Nitride Ceramics are ceramics with aluminum nitride (AIN) as the main crystal phase.
AlN crystals use [AIN4] tetrahedrons as the structural unit covalent bond compounds, with a wurtzite structure, belonging to the hexagonal system. Chemical composition: AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or off-white, single crystal is colorless and transparent, the sublimation decomposition temperature under normal pressure is 2450°C. A high-temperature heat-resistant material. Thermal expansion coefficient (4.0-6.0)X10-6/°C. Polycrystalline AIN thermal conductivity of 260W / (m.k), 5-8 times higher than aluminum oxide, so the heat and shock resistance, can withstand extremely hot 2200 °C. In addition, aluminum nitride has the property of being free from attack by molten aluminum and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid.

Application:
1. Application of optical communication devices

2. Special refrigeration unit

3.LED industry

4. Automotive electronic module

5. High efficiency power module

6. High frequency microwave application

7. Power electronic components

Material's mechanical properties and thermal conductivity dielectric properties.

Aluminum Nitride Ceramics Properties
Color	Gray	Density	3.26g/cm3
Melt Point	2200ºC	Boiling Point	2517ºC
Thermal Conductivity	320 W/m.K	Thermal expansion coefficient	3.5×10^-6K^-1
Specific heat	740J/(Kg.ºC)	Volume resistivity	>1014Ω.cm
Dielectric constant	8.2~9@1Hz	Hardness(Mohs)	9~10