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Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit

China Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit, Find details about China Reballing Kit, Emcp IC Chip from Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit

Model NO.
705-0000298
Character
High Temperature Resistance
Production Process
Welding
Interface Type
No
Brand
Sireda
Pin Count
162
Pitch
0.5mm
Contact
Pogo Pin
Package
BGA
IC Size
11.5X13mm
Payment Term
EXW
Payment Method
100% T/T in Advance
Transportation
FedEx/UPS/DHL Acceptable
Trademark
Sireda
Specification
BGA162
Origin
Shenzhen, China
Model NO.
705-0000298
Character
High Temperature Resistance
Production Process
Welding
Interface Type
No
Brand
Sireda
Pin Count
162
Pitch
0.5mm
Contact
Pogo Pin
Package
BGA
IC Size
11.5X13mm
Payment Term
EXW
Payment Method
100% T/T in Advance
Transportation
FedEx/UPS/DHL Acceptable
Trademark
Sireda
Specification
BGA162
Origin
Shenzhen, China
1. Product Description
Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit


Reballing Kit - BGA162 0.5mm eMCP 11.5x13mm
 

1. RoHS compliant

2. Reasonable temperature curve ensure good reball.

3. ESD protection.

4. Residual tin in pad recess can be removed perfectly. 

5. skilled technicians and mature process

6. Our individual design of Reball kits & fixtures

Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit
 



2. Rework Process
Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit



3. Reballing Process

     1) Reball tools
Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit

     
     2) Re-balling process

        * Prepare IC to be re-balled;

        * Put an IC into IC Guide, take care of the A1 position;

        * Apply some solder paste to the Solder Paste Stencil;

        * Put Solder Paste Stencil onto IC Guide (already with a de-soldered & cleaned IC);

        * Use Solder Paste Blade to apply solder paste onto IC pads;

        * Remove Solder Paste Stencil from IC Guide;

        * Put some solder balls to Solder Ball Stencil;

       * Put Solder Ball Stencil onto IC Guide;

       * Use Solder Ball Blade to gently press solder ball onto IC pads;

       * Take away the Solder Ball Stencil, and take out the Re-balled IC;

       * Put the re-balled IC to Reflow Oven or other Heating Device for soldering.


 
Company Profile

Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil KitSireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.


Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit

Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
 
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

Reball Fixture for Emmc BGA162 11.5X13mm IC Chip Reball Stencil Kit


 

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