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T-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, Puhui

China T-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, Puhui, Find details about China Bga Rework Station, Smd Rework Station from T-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, Puhui

Model NO.
T-870A
HS Code
85151100
Model NO.
T-870A
HS Code
85151100
T-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD Rework Station, for Laptop Motherboard, BGA Reballing Tools Machine, Taian, PuhuiT-870A BGA SMD rework station, for laptop motherboard, BGA reballing tools machine, taian, puhui

Technical parameters

Power: 1000W
Voltage: AC110V-220V 50/60Hz
Infrared lamp body power: 150W
Preheating plate power: 800W
Working bench size: 360*240mm
Infrared lamp body heating size: 50*50mm
Preheating plate size: 240*180mm
Preheating plate temperature range: 60-200C
Infrared lamp body temperature range: 200-450C

Features:

1. Infrared welding technology.
2. Infrared heating, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; User can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 50mm.
5. With 800W hot melt system, preheating range 240*180mm.
6. It doesn't impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.
7. It suits for a variety of computer, notebook, play station's BGA components, especially in a Northbridge/ Southbridge chipset of computer.

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