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BGA Rework Equipment, BGA Reballing Rework Station, Mobile Phone Motherboard Repair Welding Machine T-862

China BGA Rework Equipment, BGA Reballing Rework Station, Mobile Phone Motherboard Repair Welding Machine T-862, Find details about China Bga Rework Equipment, Bga Reballing Rework Station from BGA Rework Equipment, BGA Reballing Rework Station, Mobile Phone Motherboard Repair Welding Machine T-862

Model NO.
T-862
Model NO.
T-862
BGA Rework Equipment, BGA Reballing Rework Station, mobile phone Motherboard Repair Welding Machine T-862

BGA Rework Equipment, BGA Reballing Rework Station, Mobile Phone Motherboard Repair Welding Machine T-862

Technical parameters

Power: 600W
Voltage: AC110V-220V 50/60HZ
Infrared lamp body power: 100W
Preheating plate power: 350W
Working bench size: 350*260mm
Infrared lamp body heating size: 25*25mm
Preheating plate size: 120*80mm
Preheating plate temperature range: 450
Infrared lamp body temperature range: 100-350

BGA Rework Equipment, BGA Reballing Rework Station, Mobile Phone Motherboard Repair Welding Machine T-862

1. Infrared welding technology which was developed independently.
2. Infrared heating is easy to pierce and distribute evenly, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; User can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 25mm (T-862)With hot melt system, preheating range 120*80mm (T-862)
5. It doesn't impact the smart parts without hot air, and suits to weld all kinds of chips, especially Micro BGA components.

Warranty

Warranty the main body maintains for one year and the spare parts maintains for three months.
Service provide the immediate network online Q/A and the technical advisory work service

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