China Emcp Test Socket_11.5X13mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA254, Perform, for IC with Solder Ball, Data Recovery, Find details about China Emcp Adapter, Emcp Test Socket from Emcp Test Socket_11.5X13mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA254, Perform, for IC with Solder Ball, Data Recovery
SD solution, eMCP BGA254 test adapter to SD Card / SD Adapter
Support for eMMC version 5.0 or above.
Chip-off IC devices failure analysis, real time write-and-read in forensic application.
Support for hot plug, eMMC/eMCP can be directly connected to PC with SD Card or SD adapter.
This model 702-0001028 is for BGA254 IC chip with solder ball, if you need to test IC chip without solder ball, please contact us.
Material Socket Body | PPS |
Material Socket Lid | AL, POM |
Contact | Pogo Pin |
Operation Temperature | 0 ~ 80 ºC |
Life Span | 30 K Cycles |
Spring Force | 20g ~ 30g per Pin |
Current Rating | 1.5A |
DC Resistance | DC Resistance |