Emcp Test Socket_11.5X13mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA254, Perform, for IC with Solder Ball, Data Recovery

China Emcp Test Socket_11.5X13mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA254, Perform, for IC with Solder Ball, Data Recovery, Find details about China Emcp Adapter, Emcp Test Socket from Emcp Test Socket_11.5X13mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA254, Perform, for IC with Solder Ball, Data Recovery

Model NO.
702-0001028
Trademark
Sireda
Origin
Shenzhen, China
HS Code
8536690000
Model NO.
702-0001028
Trademark
Sireda
Origin
Shenzhen, China
HS Code
8536690000

SD solution, eMCP BGA254 test adapter to SD Card / SD Adapter
Emcp Test Socket_11.5X13mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA254, Perform, for IC with Solder Ball, Data Recovery

SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices.

Provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development. 

Applicable for eMMC,eMCP devices from Samsung, Hynix, Sandisk, Toshiba, Kingston, Intel,etc, including BGA100, BGA136, BGA153, BGA169, BGA162, BGA186, BGA221, BGA254, BGA280, BGA529. 

Support for eMMC version 5.0 or above.

Chip-off IC devices failure analysis, real time write-and-read in forensic application.

Support for hot plug, eMMC/eMCP can be directly connected to PC with SD Card or SD adapter.

This model 702-0001028 is for BGA254 IC chip with solder ball, if you need to test IC chip without solder ball, please contact us.

 

Mechanical 
Material Socket BodyPPS
Material Socket Lid AL, POM
ContactPogo Pin
Operation Temperature0 ~ 80 ºC
Life Span30 K Cycles
Spring Force20g ~ 30g per Pin


Electrical
Current Rating1.5A
DC ResistanceDC Resistance


We provide a large range of customized socket, if you have special requirement or want to learn more about us, please have a look at our website siredatech.en.made-in-china.com.