China BGA280 Test Socket_ 14X14.5mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA280, Clamshell, Perform, for IC Without Solder Ball, Find details about China BGA280 Adapter, Test Socket from BGA280 Test Socket_ 14X14.5mm with SD Adapter for Chipoff Test and Forensic Test, Compatible BGA280, Clamshell, Perform, for IC Without Solder Ball
SD solution, eMCP BGA280 test adapter to SD Card / SD Adapter
Support for eMMC version 5.0 or above.
Chip-off IC devices failure analysis, real time write-and-read in forensic application.
Support for hot plug, eMMC/eMCP can be directly connected to PC with SD Card or SD adapter.
This model 702-0001587 is for BGA280 IC chip without solder ball, if you need to test IC chip with solder ball, please contact us.
Validated by IC chip Samsung kmr21000am-a805 kmr2 m0009 m-a803.
Material Socket Body | PPS |
Material Socket Lid | AL, POM |
Contact | Pogo Pin |
Operation Temperature | 0 ~ 80 ºC |
Life Span | 30 K Cycles |
Spring Force | 20g ~ 30g per Pin |
Current Rating | 1.5A |
DC Resistance | <100mΩ@0.65mm |