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Android Mobile Phone Main Board Computer Motherboard PCB Assembly PCBA

China Android Mobile Phone Main Board Computer Motherboard PCB Assembly PCBA, Find details about China PCBA, Manufactur PCBA from Android Mobile Phone Main Board Computer Motherboard PCB Assembly PCBA

Model NO.
PCBA01
Metal Coating
Hal,Plated Ni/Au,Imm Silver,Imm Ni/Au/Sn,Hard Gold
Mode of Production
SMT
Layers
Multilayer
Base Material
Fr4,Hi-Tg, Fr06,Rogers, Taconic,Argon,Nalco,Isola
Certification
RoHS, ISO, UL
Customized
Customized
Condition
Used
Certificate
UL/ISO/Ts16949/RoHS/Ts16949
Solder Mask Color
Green Black Blue White
Number of Layer
1-22 Layers
Service
Professional Engineer,Good After Service,Competiti
PCB Standard
Ipc-a-610 D/Ipc-III Standard
Hole Tolerance
Pth: ±2mil, Ntph: ±2mil
Board Thickness Tolerance
±10%
Impedance Control Tolerance
±5%
Testing Service
100% Aoi Testing, 100% Et Testing,100% Fqc
PCB Assembly Process
DIP. SMT PCB Assembly
Copper Thickness
0.5oz-8oz
Board Thickness
0.2mm-4mm
Min. Hole Size
0.1mm-1mm
Min. Line Width
3mil-10mil
Min. Line Spacing
2mil
Transport Package
by Vacuum Packing in Cartons
Origin
Shenzhen, China

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