Products

High Thermal Conductivity Aln Ceramic Substrate

China High Thermal Conductivity Aln Ceramic Substrate, Find details about China Aln Ceramic Substrate, Aln Tube from High Thermal Conductivity Aln Ceramic Substrate

Model NO.
TC-027
Type
Electrothermal Ceramics
Thermal Conductivity
160-190W/M-K
Lead Time
1-3 Working Days
Maximum Voltage
<10kv
Color
Grey
Shiping Way
DHL/Aramex/UPS/TNT
Density
3.3G/Cm3
Condition
100% Original New
Trademark
JRFT
Transport Package
Carton
Specification
Customize
Origin
China
HS Code
8547100000
Model NO.
TC-027
Type
Electrothermal Ceramics
Thermal Conductivity
160-190W/M-K
Lead Time
1-3 Working Days
Maximum Voltage
<10kv
Color
Grey
Shiping Way
DHL/Aramex/UPS/TNT
Density
3.3G/Cm3
Condition
100% Original New
Trademark
JRFT
Transport Package
Carton
Specification
Customize
Origin
China
HS Code
8547100000
                High Thermal Conductivity AlN Tube / AlN Ceramic Substrate For Electronic Device

High Thermal Conductivity Aln Ceramic Substrate

Feature:
1.High hardness , diversity                               2. High precision and density
3.High reliability and stability                              4. High thermal conductivity
5.Extremely abrasive resistance performance               6. Wide scope of application
 

MATERIAL PROPERTIES
 
Material Properties of Aluminum Nitride Substrate/Wafer
Property ContentProperty Index
Density(g/cm3)3.335
Resistance to Thermal ShockNo Cracks
Thermal conductivity(30°C, W/m.k)≥170
Linear expansion coefficient
(/°C, 5°C/min, 20-300°C)		2.805×10-6
Flexural strength (MPa)382.7
Volume Resistivity (Ω.cm)1.4×1014
Dielectric constant(1MHz)8.56
Chemical Durability (mg/cm2)0.97
Dielectric strength (KV/mm)18.45
Surface roughness Ra(μm)0.3~0.5
Camber (length‰)≤2‰
Appearance/ ColorDense/ Dark Gray

Application:

high-power circuits, RF and microwave circuits , GaAs crystal crucible, Al evaporation pan, MHD power generation equipment
 
Product Introduction
 
Aluminum nitride ceramic substrate, high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical resistance, high resistivity , low dielectric loss, is the ideal LSI heat dissipation board and packaging materials.
 
AIN ceramics use heat resistant melt erosion and thermal shock resistance, can produce GaAs crystal crucible, Al evaporation pan, MHD power generation equipment and high temperature turbine corrosion resistant parts, using its optical properties can be used as an infrared window.
 
Non-standard products , please contact us to provide drawings of your products.
welcome drawings processing customized zirconia /alumina / aluminum nitride . 

Our office
High Thermal Conductivity Aln Ceramic Substrate
FAQ
1. Are you trade company or manufacturer?
We are China professional manufacturer of customizing various thermal interface materials, such as silicone gap pad, thermal conductive tape, thermal conductive graphite etc with more than 11 years experience in this line.

2. Why price is so low?
You are ordering from factory bottom price!

3. How can you guarantee the quality?
With advanced production machine and testing equipment, we ensure 100% quality inspection before shipping.

4.What's the lead time?
Sample order costs 1-3 working days, and 7-15 working days for mass production.

5. Can I take sample?
Yes, we are honored to provide you sample.

6.What payment term is available?
We can accept Paypal, TT, Western Union.


Contact Information : 

We can make many specifications according to your requests . 

Free samples are available , for more information , pls kindly let me . 

You Might Also Like