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Electro-Plating Chemical Materials Copper Pyrophosphate

China Electro-Plating Chemical Materials Copper Pyrophosphate, Find details about China Tcpp, Cupric Pyrophosphate from Electro-Plating Chemical Materials Copper Pyrophosphate

Model NO.
CL-TCPP
Trademark
Junlin
Specification
N. W 20kgs/bag
Origin
Sichuan
HS Code
2835399000
Model NO.
CL-TCPP
Trademark
Junlin
Specification
N. W 20kgs/bag
Origin
Sichuan
HS Code
2835399000
Cupric Pypophosphate
Executive Standard: HG/T 3593-1999, Q/2794-2008
Molecular formula: Cu2P2O7
Molecular weight: 301.05
Character:The product is light green or blue powdery solids, dissolves easily in acid, but insoluble in water. Mainly used in elelctroplating, widely used in  pyrophosphate copper facing, bronzing, rhinemetal and so on.

Technical Specifications:

Index Specification
Electroplating grade
High purity grade
AppearanceLight blue powder or granuleLight blue powder or granule
Purity (Cu2P2O7.4H2O) %≥99≥99.9
Copper (Cu) %≥34≥34
Ferum (Fe) %≤0.008≤0.005
Arsenic (As) %≤0.0005≤0.0003
Plumbum (Pb) %≤0.001≤0.0005
() Heave metals (as Pb)%≤0.005≤0.001
Sulfate (SO4) %≤0.5≤0.5

Acid insoluble %		≤0.1≤0.05
Electro-Plating Chemical Materials Copper Pyrophosphate
Electro-Plating Chemical Materials Copper Pyrophosphate
Electro-Plating Chemical Materials Copper Pyrophosphate


 

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