Silicon Wafers Fiber Laser Scriber Cutting Machine

China Silicon Wafers Fiber Laser Scriber Cutting Machine, Find details about China Silicon Wafers Laser Scriber Machine, Silicon Wafers Laser Cutting Machine from Silicon Wafers Fiber Laser Scriber Cutting Machine

Model NO.
SW-FLM
Customized
Customized
Standard Modular Design
Standard Modular Design
Cooling System
Air Cooling
Applicable Material
Nonmetal
Technical Class
Continuous Wave Laser
Type
Optical Fiber Laser
Cutting Depth
0.001mm-0.6mm
Minimum Displacement
0.01 mm
Cutting Speed
10-100mm/S
Lase Head Movement Stroke
50cm
Movement Accuracy
0.03mm
Workbench Size
300mm × 300mm
Output Fiber Length
2.5m
Laser Pulse Repetition Rate
20kHz~100kHz
Power
50W
Trademark
Superwave laser
Transport Package
Standard Wooden Box Packaging
Specification
1080mm*950mm*1651mm
Origin
Shenzhen, China