Diamond / CBN blades for the precision cutting of wafer, magnetic head, IC, LSI, optical biber etc.Resin, metal and electroformed bonds

Our factory is a world leader in the development and manufacturer of dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.

Nickel-bond Dicing Blades

The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as:PCB, Silicon and BGA
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)

Resin-bond Dicing Blades

Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as:QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).