China High Quality Fr4 Multilayer PCB Plating

China High Quality Fr4 Multilayer PCB Plating, Find details about China Pcb Plating, Fr4 Multilayer from China High Quality Fr4 Multilayer PCB Plating

Model NO.
oem
Metal Coating
Copper
Mode of Production
SMT or DIP
Base Material
FR-4
Min. IC Pitch
0.30mm(12mil)
Foot Pin
So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
Min. Chip Placement
01005
Max. PCB Size
410mm X 600mm(16.2" X 23.6")
Min. PCB Thickness
0.35mm(13.8mil)
Maximum BGA Size
74mm X 74mm(2.9" X 2.9")
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
BGA Ball Diameter
0.4mm ~ 1mm(16mil ~ 40mil)
Qfp Lead Pitch
0.38mm ~ 2.54mm(15mil ~ 100mil)
Layers
1 ~ 30 Layers
Trademark
oem
Specification
RoHS, SGS, UL, IPC class II
Origin
China
HS Code
8534001000