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Multilayer PCB Design/PCB Manufacture/PCB Assembly PCB MCPCB

China Multilayer PCB Design/PCB Manufacture/PCB Assembly PCB MCPCB, Find details about China Pcb Mcpcb, Camera Module Pcb from Multilayer PCB Design/PCB Manufacture/PCB Assembly PCB MCPCB

Model NO.
oem ODM
Metal Coating
Copper
Mode of Production
SMT or DIP
Base Material
FR-4
Min. IC Pitch
0.30mm(12mil)
Foot Pin
So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
Min. Chip Placement
01005
Max. PCB Size
410mm X 600mm(16.2" X 23.6")
Min. PCB Thickness
0.35mm(13.8mil)
Maximum BGA Size
74mm X 74mm(2.9" X 2.9")
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
BGA Ball Diameter
0.4mm ~ 1mm(16mil ~ 40mil)
Qfp Lead Pitch
0.38mm ~ 2.54mm(15mil ~ 100mil)
Layers
1 ~ 30 Layers
Trademark
oem
Specification
RoHS, SGS, UL, IPC class II
Origin
China
HS Code
8534001000

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